15.HOWTOREPLACEAFLATPACKAGEIC
15.1.PREPARATION
-PbF(:Pbfree)Solder
-SolderingIron
TipTemperatureof700°F±20°F(370°C±10°C)
Note:Werecommenda30to40Wattsolderingiron.Anexpertmaybe
abletousea60to80Wattironwheresomeonewithlessexperience
couldoverheatanddamagethePCBfoil.
-Flux
RecommendedFlux:SpecificGravity 0.82.
Type RMA(lowerresidue,non-cleaningtype)
Note:SeeABOUTLEADFREESOLDER(PbF:Pbfree)().
15.2.PROCEDURE
1.TacktheflatpackICtothePCBbytemporarilysolderingtwo
diagonallyoppositepinsinthecorrectpositionsonthePCB.
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