Reference: WX-B-009-01
Title: Product Performance
Specification
Rev./Status: 0.2 / Draft
Model : FX20 FX30 FX50 Page 16 of 19
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FX20 FX30 FX50
Mini Audio system
- 2013-12-09
2 - 2014-02-28
3
NAME
Suhaofeng/Tangbing 19 10 - 16 A4
CHECK DATE
2014-02-28
REMARKS:
3.5 MECHANICAL
3.5.1 Shock Sensitivity
Refer to Quality plan for the details of the test discs and testing method.
Requirement:
No muting, plop sounds, picture freeze/jerk or audible/visible interference when impacting with force of -
In the ±X and ±Y directions: F ≥ 3g / 3ms, ΔV = 0.06ms
In the ± Z direction: F ≥ 2g / 3ms, ΔV = 0.04ms
Where g = acceleration due to gravity.
3.5.2 Thermal Performance
Refer to Quality plan for the details of the testing method.
Requirements:
1. Set should function normally
2. Temperature rise of accessible parts such as metallic enclosures (casing) shall not exceed 40˚C
above the ambient temperature.
3. Temperature rise of PCB prints shall not exceed 85˚C
4. Temperature readings of all mechanical / electrical components and modules shall not exceed their
specification limits. The calculated junction temperature of semiconductors shall also not exceed
spec limits.
3.5.3 Noise Specifications
Test Conditions:
Measurements are to be made inside an Anechoic Chamber (echo-free environment) with ambient noise of
less than 16dBA.
Measurements are to be taken at the following positions: -
(a) Top-Surface and at center of Front-Cabinet
(b) Front-Surface and at center of Front-Cabinet.
The microphone is to be positioned 10cm from abovementioned surfaces.
Set Functional State
Requirement
Normal
Idle State
Standby Mode < 20 dBA
Set On and "No Disc" mode < 20 dBA
Tray Open/Close
Start/End peak noise < 65 dBA
Tray running noise (RMS) < 50 dBA
CDDA & SACD --- SBC442
< 35 dBA
(Stereo & Multichannel)
Play (first & last tracks) <30dBA
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