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Details the TFA9843AJ as a 20W stereo power amplifier with volume control, its package and pin compatibility.
Lists features such as 2-channel SE operation, soft clipping, input clamps, volume control, and mute/standby modes.
Includes low standby current, high supply voltage ripple rejection, and output short-circuit/thermal protection.
Lists common applications including CRT TV, monitors, PC speakers, boom boxes, and mini audio receivers.
Presents key electrical parameters like supply voltage, quiescent current, output power, THD, voltage gain, and SVRR.
Specifies the type number TFA9843AJ, package DBS9P, and its description.
Illustrates the internal blocks of the TFA9843AJ, including inputs, outputs, volume control, and protection circuits.
Shows the physical pin arrangement of the TFA9843AJ IC.
Details the function of each pin (IN1, IN2, OUT1, OUT2, CIV, VC, SVR, GND, Vcc) of the TFA9843AJ.
Describes the input cut-off frequency calculation and input clamping behavior.
Details the single-ended amplifier, output stage, peak output current, and measurement of output power.
Discusses dynamic headroom requirements for music and power dissipation for heatsink calculations.
Explains the four functional modes (Standby, Mute, Volume control, On) selectable via the VC pin.
Details the SVRR measurement and the effect of capacitor selection on ripple rejection.
Describes temperature sensors and protection mechanisms against short-circuits and overheating.
Lists the absolute maximum limits for supply voltage, input voltage, current, and temperature.
Provides thermal resistance values (junction-to-ambient, junction-to-case) for package thermal analysis.
Details static characteristics like supply voltage, currents, input/output voltages, and input current.
Lists dynamic parameters such as output power, THD, voltage gain, input impedance, noise, and SVRR.
Presents circuit diagrams for typical applications and important remarks.
Shows the schematic for a single-ended application, including component values and connections.
Illustrates different circuits for driving the volume control (VC) pin using PWM or potentiometers.
Provides essential grounding techniques for optimal system performance and signal integrity.
Explains the importance of supply bypassing for low noise and ripple rejection.
Details thermal resistance and provides a method for calculating heatsink requirements for various operating conditions.
States the applicable quality specification for integrated circuits.
Provides detailed mechanical dimensions and references for the DBS9P package.
Introduces wave, dip, and manual soldering techniques for through-hole mount packages.
Discusses lead-free solder paste trends and dwell times for wave/dip soldering.
Provides instructions for manual soldering with an iron, including temperature and contact time limits.
Details the suitability of different package types for dipping and wave soldering methods.
Tracks changes and release dates for the document, starting from its preliminary status.
Defines the status of the document (objective, preliminary, product) and product status.
Explains terms like 'Draft' and 'Short data sheet' used within the document.
Covers general disclaimers, right to change, suitability for use, applications, limiting values, and terms of sale.
Lists referenced brands, product names, and trademarks.
Provides website links for product information and email addresses for sales offices.
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