Do you have a question about the Philips TDA8943SF and is the answer not in the manual?
Pin configuration diagram.
Detailed pinout and their functions.
How to connect input pins and circuit configuration.
Description of the BTL amplifier stage and its advantages.
How output power is measured and its limiting factors.
Discussion of dynamic headroom and its impact on power.
Explanation of the three operational modes (standby, mute, operate).
Procedure to avoid audible plops during power transitions.
How SVRR is measured and its impact on performance.
Description of short-circuit and thermal shutdown protection.
Guidelines for PCB layout and grounding techniques.
Calculation of heatsink requirements based on thermal parameters.
Applicable quality specifications for the integrated circuit.
Specifies the standard conditions for testing the device.
Overview of soldering methods for IC packages.
Details on wave and dip soldering parameters and limits.
Guidelines for hand soldering the IC package.
Suitability of packages for different soldering methods.
Pin configuration diagram.
Detailed pinout and their functions.
How to connect input pins and circuit configuration.
Description of the BTL amplifier stage and its advantages.
How output power is measured and its limiting factors.
Discussion of dynamic headroom and its impact on power.
Explanation of the three operational modes (standby, mute, operate).
Procedure to avoid audible plops during power transitions.
How SVRR is measured and its impact on performance.
Description of short-circuit and thermal shutdown protection.
Guidelines for PCB layout and grounding techniques.
Calculation of heatsink requirements based on thermal parameters.
Applicable quality specifications for the integrated circuit.
Specifies the standard conditions for testing the device.
Overview of soldering methods for IC packages.
Details on wave and dip soldering parameters and limits.
Guidelines for hand soldering the IC package.
Suitability of packages for different soldering methods.
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