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Philips TDA8943SF - User Manual

Philips TDA8943SF
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TDA8943SF
6 W mono Bridge Tied Load (BTL) audio amplifier
Rev. 02 — 7 April 2000 Product specification
c
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1. General description
The TDA8943SF is a single-channel audio power amplifier with an output power of
6 W at an 8 load and a 12 V supply. The circuit contains a Bridge Tied Load (BTL)
amplifier with an all-NPN output stage and standby/mute logic. The TDA8943SF
comes in a 9-lead single in-line (SIL) medium power package. The TDA8943SF is
printed-circuit board (PCB) compatible with all other types in the TDA894x family.
One PCB footprint accommodates both the mono and the stereo products.
2. Features
Few external components
Fixed gain
Standby and mute mode
No on/off switching plops
Low standby current
High supply voltage ripple rejection
Outputs short-circuit protected to ground, supply and across the load
Thermally protected
Printed-circuit board compatible.
3. Applications
Mains fed applications (e.g. TV sound)
PC audio
Portable audio.
4. Quick reference data
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
CC
supply voltage 6 12 18 V
I
q
quiescent supply current V
CC
=12V; R
L
= - 1522mA
I
stb
standby supply current - - 10 µA
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Summary

General description

Features

Applications

Quick reference data

Ordering information

Block diagram

Pinning information

Pinning

Pin configuration diagram.

Pin description

Detailed pinout and their functions.

Functional description

Input configuration

How to connect input pins and circuit configuration.

Power amplifier

Description of the BTL amplifier stage and its advantages.

Output power measurement

How output power is measured and its limiting factors.

Headroom

Discussion of dynamic headroom and its impact on power.

Mode selection

Explanation of the three operational modes (standby, mute, operate).

Switch-on and switch-off

Procedure to avoid audible plops during power transitions.

Supply Voltage Ripple Rejection (SVRR)

How SVRR is measured and its impact on performance.

Built-in protection circuits

Description of short-circuit and thermal shutdown protection.

Limiting values

Thermal characteristics

Static characteristics

Dynamic characteristics

Internal circuitry

Application information

Printed-circuit board (PCB)

Guidelines for PCB layout and grounding techniques.

Thermal behaviour and heatsink calculation

Calculation of heatsink requirements based on thermal parameters.

Test information

Quality information

Applicable quality specifications for the integrated circuit.

Test conditions

Specifies the standard conditions for testing the device.

Package outline

Soldering

Introduction to soldering through-hole mount packages

Overview of soldering methods for IC packages.

Soldering by dipping or by solder wave

Details on wave and dip soldering parameters and limits.

Manual soldering

Guidelines for hand soldering the IC package.

Package related soldering information

Suitability of packages for different soldering methods.

Revision history

Data sheet status

Definitions

Disclaimers

Summary

General description

Features

Applications

Quick reference data

Ordering information

Block diagram

Pinning information

Pinning

Pin configuration diagram.

Pin description

Detailed pinout and their functions.

Functional description

Input configuration

How to connect input pins and circuit configuration.

Power amplifier

Description of the BTL amplifier stage and its advantages.

Output power measurement

How output power is measured and its limiting factors.

Headroom

Discussion of dynamic headroom and its impact on power.

Mode selection

Explanation of the three operational modes (standby, mute, operate).

Switch-on and switch-off

Procedure to avoid audible plops during power transitions.

Supply Voltage Ripple Rejection (SVRR)

How SVRR is measured and its impact on performance.

Built-in protection circuits

Description of short-circuit and thermal shutdown protection.

Limiting values

Thermal characteristics

Static characteristics

Dynamic characteristics

Internal circuitry

Application information

Printed-circuit board (PCB)

Guidelines for PCB layout and grounding techniques.

Thermal behaviour and heatsink calculation

Calculation of heatsink requirements based on thermal parameters.

Test information

Quality information

Applicable quality specifications for the integrated circuit.

Test conditions

Specifies the standard conditions for testing the device.

Package outline

Soldering

Introduction to soldering through-hole mount packages

Overview of soldering methods for IC packages.

Soldering by dipping or by solder wave

Details on wave and dip soldering parameters and limits.

Manual soldering

Guidelines for hand soldering the IC package.

Package related soldering information

Suitability of packages for different soldering methods.

Revision history

Data sheet status

Definitions

Disclaimers

Philips TDA8943SF Specifications

General IconGeneral
BrandPhilips
ModelTDA8943SF
CategoryAmplifier
LanguageEnglish

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