Philips TDA8943SF - Package outline

Philips Semiconductors
TDA8943SF
6 W mono Bridge Tied Load (BTL) audio amplifier
Product specification Rev. 02 — 7 April 2000 15 of 20
9397 750 06865
© Philips Electronics N.V. 2000. All rights reserved.
16. Package outline
Fig 15. SIL9MPF package outline.
UNIT
A
A
max.
2
A
3
b
1
D
1
b
2
bcD
(1)
E
(1)
Z
max.
(1)
eLPP
1
q
1
q
2
q
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
18.5
17.8
3.7
8.7
8.0
A
4
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
3.4
3.2
2.54
1.0
5.9
5.7
4.4
4.2
3.9
3.4
15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1
92-11-17
95-02-25
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A
2
3
A
4
q
1
q
2
L
Q
w M
b
b
1
b
2
D
1
P
q
1
Z
e
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1