AVIC-Z110BT/XN/UC
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1.2 NOTES ON SOLDERING
EJECT LOCK MODE for DVD mechanism
In order to change the EJECT LOCK/UNLOCK status of the mechanism, please perform following procedure.
< Procedure >
Top Menu -> AV Source -> Source OFF
Short push area "A" -> Short push area "B" -> Long push area "C" on above screen.
(In order to change the status, follow the same operation.)
The current status can be confirmed by "OFF" character color.
Eject Lock: ON
(Blue character)
Eject Lock: OFF
(White character)
For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
Compared with conventional eutectic solders, lead-free solders have higher melting points, by approximately 40 C.
Therefore, for lead-free soldering, the tip temperature of a soldering iron must be set to around 373 C in general, although
the temperature depends on the heat capacity of the PC board on which reworking is required and the weight of the tip of
the soldering iron.
Compared with eutectic solders, lead-free solders have higher bond strengths but slower wetting times and higher melting
temperatures (hard to melt/easy to harden).
The following lead-free solders are available as service parts:
Parts numbers of lead-free solder:
GYP1006 1.0 in dia.
GYP1007 0.6 in dia.
GYP1008 0.3 in dia.
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