POWATEC P-200 - Tape Cutting and Removal

EPFLCenterofMicroNanoTechnology
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CMi/WafermountingwithPOWATECP‐200andU‐200    Page3/6
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5‐ Usethemanualrollingpadtonicely stickthetapetothewafer+theframe.Onesinglepass
isenough.Keeprollinguntilreachingtherollthetapewasinitiallystuckto.
Note:
ifthewaferishigherthantheframe,youmayneedtoadjustthetapestickingmanually.
 
6‐ Lowerthecuttingsystem.First,cutthetoppartofthetapebygentlypressingdownthe
bladeandgoingbackandforthonthetrack.Then,cutthewholeperiphery
oftheframe
usingthecircularcuttingblade.
 
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7‐ Liftthecuttingsystembackup.Usingonehandtoholdtheframesteadyagainstthe
machine,usetheotheronetoremovethecutpartofthetape.
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Rollallthewayup Adjustmanuallyifneeded
Cutthetoppart
Cuttheperiphery
Removetape