LED SMT Reflow Oven T-980 User Manual
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interface has an indicator light to indicate), the power should be cut off to prevent
damage to the circuit board and chip;Adjust the temp curve when the temp is stable.
⑤
.At present, there are many kinds of solder production and use, and each company
chooses different ones. There are many articles about theoretical analysis and test
analysis.For these reasons, the product launched by our company can preset eight
curves, each curve has 8 sections, and the heating time of each section can be
changed.The user can reset the heating curve according to the required heating
temperature and time of solder.
Foundation for wave set
1. The reflow soldering theory and the temperature wave
When the PCB board goes into heat up area (dry area), the solvent and gas in the
solder paste will evaporate. At the same time, the flux can wet the pad and the
component tip and foot. The solder paste melts, caves in and covers the pad, leading
to the pad and component pins insulate the oxygen. PCB board goes into heat
preservation area. PCB board and components get full preheating. In case of
damaging the PCB and components when it goes into the welding area and the
temperature heats up quickly. When PCB board goes into the welding area, the
temperature heats up and the solder paste melts. When PCB board goes in to
cooling area, the liquid solder paste the soldering points solidify. The reflow
process is finished.
The temperature is the key to welding quality. The actual and the setting
temperature warming slope and the peak temperature should be accordant. Before
the temperature reaches 160℃, please control the heat up speed in about 1℃/S. If
heat up too quickly, the PCB board and the components will be damaged, and the
PCB board may be out of shape. On the other side, the flux volatilizes too fast. And
it is easy to make soldering tin ball. Set the peak temperature 20℃-40℃ higher
than the solder paste melting point. Set the reflow time 10S-60S. If the peak
temperature is low or the reflow time is short, it will affect the welding quality, and
serious is causing the solder paste does not melt. If the peak temperature is high or
the reflow time is long, the metal power will be oxidized and affect the welding
quality and serious is causing the component and PCB board damaged.
2. The set of the temperature wave
Set the wave according to the solder paste and the above foundation. Different
solder paste, choose and set different waves. In addition, the temperature wave has
related to the PCB, the density and size of components. Generally lead-free welding
temperature should be higher 40℃ than melting point.
Temperature Area Set
1. Set the temperature and belt speed based on initial value(usually the manufacturer
supply when adjust)
2. To the cooling oven, should be preheated for 20-30 minutes.
3. When the temperature is stable, let PCB board pass heat reflow system.
Under this set, the solder paste can reach the reflow critical point. If there is
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