Quectel EG21-G - Page 9

LTE Module Series
EG21-G Hardware Design
EG21-G_Hardware_Design 8 / 100
FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 75
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................... 75
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 77
FIGURE 44: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 78
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 79
FIGURE 46: TOP VIEW OF THE MODULE ...................................................................................................... 80
FIGURE 47: BOTTOM VIEW OF THE MODULE .............................................................................................. 80
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 82
FIGURE 49: TAPE AND REEL SPECIFICATIONS ........................................................................................... 84
FIGURE 51: TAPE AND REEL DIRECTIONS ................................................................................................... 84