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Quectel M66

Quectel M66
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BC68&M66
Compatible Design
NB-IoT/GSM/GPRS Module Series
Rev. BC68&M66_Compatible_Design_V1.0
Date: 2018-03-22
Status: Released
www.quectel.com

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Quectel M66 Specifications

General IconGeneral
CategoryGSM/GPRS Module
Frequency BandsGSM 850/900/1800/1900 MHz
GPRSClass 12
Operating Temperature-40°C to +85°C
Voice CodecHR, FR, EFR, AMR
GPRS Data RateMax 85.6 kbps (DL), Max 42.8 kbps (UL)
InterfacesUART, ADC
ProtocolsPPP, TCP/IP, UDP, FTP, HTTP
SIM Card1.8V/3.0V
CertificationsCE, GCF, FCC, PTCRB, IC
Supply Voltage3.3V ~ 4.5V (Typ. 3.8V)
AntennaExternal Antenna

Summary

Introduction

General Descriptions

Product Description

Details the specifications and differences between BC68 and M66 modules.

Features Overview

Compares the general properties and features of BC68 and M66 modules.

Pin Assignment

Illustrates the pin assignments for both BC68 and M66 modules.

Pin Description

Hardware Reference Design

Power Supply

Explains the power supply requirements and reference design for BC68 and M66.

Power-on Circuit

Details the circuit and timing for powering on the BC68 and M66 modules.

Power-off Circuit

Describes methods for powering down the BC68 and M66 modules.

Reset BC68

Explains the hardware and software methods for resetting the BC68 module.

Network Status Indication

Describes how to use the NETLIGHT pin for network status indication.

(U)SIM Interface

Details the compatible (U)SIM interface design for BC68 and M66.

UART Interfaces

Discusses the voltage domain differences and reference design for UART interfaces.

ADC Interface

Explains the ADC input channels for BC68 and M66 modules.

RF Antenna Interface

Covers the RF antenna interface compatibility and reference circuit.

Recommended Footprint and Stencil Design

Recommended Compatible Footprint

Shows the recommended footprint layout for BC68 and M66 modules.

Recommended Stencil Design

Details the recommended stencil thickness and design for soldering.

Installation Sketch Map

Illustrates the installation sketch map for BC68 and M66 modules on a PCB.

Manufacturing and Packaging

Soldering

Explains the soldering process, including reflow soldering thermal profile.

Packaging

Describes the packaging methods, tape dimensions, and reel details for BC68 and M66 modules.

Appendix A References

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