Quectel M66

GSM/GPRS/NB-IoT Module Series
BC68&M66 Compatible Design
BC68&M66_Compatible_Design 3 / 31
Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 4
Figure Index ................................................................................................................................................. 5
1 Introduction .......................................................................................................................................... 6
2 General Descriptions ........................................................................................................................... 7
2.1. Product Description ................................................................................................................... 7
2.2. Features Overview .................................................................................................................... 8
2.3. Pin Assignment ........................................................................................................................ 10
3 Pin Description ................................................................................................................................... 11
4 Hardware Reference Design ............................................................................................................. 14
4.1. Power Supply .......................................................................................................................... 14
4.1.1. Reference Design for Power Supply .............................................................................. 14
4.1.2. Reduce Voltage Drop ..................................................................................................... 14
4.2. Power-on Circuit ...................................................................................................................... 15
4.3. Power-off Circuit ...................................................................................................................... 16
4.3.1. Power down Module via AT Command .......................................................................... 16
4.3.2. Power down M66 Using PWRKEY Pin .......................................................................... 17
4.4. Reset BC68 ............................................................................................................................. 18
4.5. Network Status Indication ........................................................................................................ 19
4.6. (U)SIM Interface ...................................................................................................................... 19
4.7. UART Interfaces ...................................................................................................................... 20
4.8. ADC Interface .......................................................................................................................... 21
4.9. RF Antenna Interface .............................................................................................................. 22
5 Recommended Footprint and Stencil Design ................................................................................. 23
5.1. Recommended Compatible Footprint ..................................................................................... 23
5.2. Recommended Stencil Design ................................................................................................ 25
5.3. Installation Sketch Map ........................................................................................................... 27
6 Manufacturing and Packaging .......................................................................................................... 28
6.1. Soldering ................................................................................................................................. 28
6.2. Packaging ................................................................................................................................ 29
6.2.1. BC68 and M66 Packaging ............................................................................................. 29
7 Appendix A References ..................................................................................................................... 30