3
CONTENTS
ⅠⅠ
.. SSPPEECCIIFFIICCAATTIIOONN
1. SPECIFICATION ……………………………………………………………………………………………… 4
2. SYSTEM REQUIRMENT ……………………………………………………………………………………… 5
3. TFT LCD PANEL MARK ………………………………………………………………………………………6
4. CONNECTION DIAGRAM ………………………………………………………………………………………7
5. PRODUCT EXTERIOR …………………………………………………………………………………………8
ⅡⅡ
.. SSOOFFTTWWAARREE IINNSSTTAALLLLAATTIIOONN
………………………………………………………………………10
ⅢⅢ
.. EEXXPPLLOODDEEDD VVIIEEWW AANNDD PPAARRTTSS LLIISSTT
1.
FRONT COVER ASSEMBLY
……………………………………………………………………………… 14
2. B
ODY ASSEMBLY
………………………………………………………………………………………… 16
3. BACK COVER ASSEMBLY ………………………………………………………………………………… 18
4. PACKING ITEM ………………………………………………………………………………………………20
5. INITIAL PARTS LIST …………………………………………………………………………………………22
ⅣⅣ
.. AADDJJSSUUTTMMEENNTT
1.
REPLACEMENT PARTS AND ADJUSTMENT ITEMS
…………………………………………………… 23
2. ADJUSTMENT TOOLS …………………………………………………………………………………………23
3. FIRMWARE UPGRADE…………………………………………………………………………………………24
4. ADJUSTMENT ITEMS
1) FOCUS ADJUSTMENT ……………………………………………………………………………………24
2) BAD PIXEL ADJUSTMENT ………………………………………………………………………………25
3) AWB ADJUSTMENT ………………………………………………………………………………………28
4) TRIG ADJUSTMENT ………………………………………………………………………………………28
5) LCD ADJUSTMENT…………………………………………………………………………………………29
6) STROBO ADJUSTMENT ……………………………………………………………………………………30
ⅤⅤ
.. PPRROODDUUCCTTSS CCOONNSSTTRRUUCCTTIIOONN
1. PARTS ARRANGEMENT FOR EACH PCB ASS’Y
1) MAIN PCB ASSEMBLY ……………………………………………………………………………………31
2) POWER PCB ASSEMBLY …………………………………………………………………………………33
3) TOP PCB ASSEMBLY ……………………………………………………………………………………35
2. BLOCK DIAGRAM ……………………………………………………………………………………………36
3. CIRCUIT DIAGRAM
1) BLOCK DIAGRAM …………………………………………………………………………………………37
2) INTERFACE …………………………………………………………………………………………………38
3) LCD …………………………………………………………………………………………………………39
4) CPU …………………………………………………………………………………………………………40
5) CMOS ………………………………………………………………………………………………………41
6) SDRAM, FLASH & SD CARD …………………………………………………………………………42
7) UI ……………………………………………………………………………………………………………43
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