Samsung MX-F730 - Safety Warnings; CLASS 1 LASER PRODUCT; FCC NOTE (for U.S.A)

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.SafetyPrecautions...................................................................................................................1−1
1.2.ServicingPrecautions...............................................................................................................1−3
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4
2.ProductSpecication.........................................................................................................................2−1
2.1.ProductFeature.......................................................................................................................2−1
2.2.Specications..........................................................................................................................2−2
2.3.SpecicationsAnalysis.............................................................................................................2−3
2.4.Accessories............................................................................................................................2−4
2.4.1.SuppliedAccessories...................................................................................................2−4
3.DisassemblyandReassembly..............................................................................................................3−1
3.1.MainDisassemblyandReassembly.............................................................................................3−1
3.2.DECKDisassemblyandReassembly...........................................................................................3−6
4.Troubleshooting................................................................................................................................4−1
4.1.CheckpointsbyErrorMode.......................................................................................................4−1
4.1.1.NoPower...................................................................................................................4−2
4.1.2.NoOutput..................................................................................................................4−4
4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−5
4.2.1.OperationofPowerBlockProtectionCircuit....................................................................4−5
4.2.2.CheckAMPinPowerProtection....................................................................................4−6
4.3.MICOM,MPEGInitialization&Update......................................................................................4−7
4.4.Buyer-RegionCodeSettingMethod............................................................................................4−8
4.4.1.TheinsertingmethodofRegionCodeafterreplacingtheMainPBA.....................................4−8
5.PCBDiagram...................................................................................................................................5−1
5.1.WiringDiagram.......................................................................................................................5−1
5.2.FRONTPCBTop....................................................................................................................5−2
5.2.1.PinConnection...........................................................................................................5−3
5.3.FRONTPCBBottom...............................................................................................................5−4
5.4.MAINPCBTop......................................................................................................................5−5
5.4.1.PinConnection...........................................................................................................5−6
5.4.2.TestPointWaveForm..................................................................................................5−7
5.5.MAINPCBBottom..................................................................................................................5−8
5.6.SMPSPCBTop.......................................................................................................................5−9
5.6.1.PinConnection...........................................................................................................5−10
5.7.SMPSPCBBottom..................................................................................................................5−11
6.SchematicDiagram...........................................................................................................................6−1
6.1.OverallBlockDiagram.............................................................................................................6−1
6.2.FRONT.................................................................................................................................6−2
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