Samsung NP900X4D - Table of Contents

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1
1.2.SafetyPrecautions...................................................................................................................1−2
1.3.Ground..................................................................................................................................1−3
1.4.StaticElectricityPrecautions......................................................................................................1−4
2.Introduction.....................................................................................................................................2−1
2.1.ProductFeatures......................................................................................................................2−1
2.2.Specication...........................................................................................................................2−2
2.3.Comparingproductspecications...............................................................................................2−7
2.4.FunctionofProduct..................................................................................................................2−8
2.5.NewTechnology/ability..........................................................................................................2−14
2.6.Hardware...............................................................................................................................2−21
2.7.Software................................................................................................................................2−27
2.8.BiosSetup..............................................................................................................................2−29
2.9.HW&OptionMaterials............................................................................................................2−34
3.DesassemblyandReassembly..............................................................................................................3−1
3.1.MainSystem...........................................................................................................................3−1
3.2.TOPA ’ssy..............................................................................................................................3−4
3.3.LCDA’ssy..............................................................................................................................3−6
4.Troubleshooting...............................................................................................................................4−1
4.1.Generalspec...........................................................................................................................4−1
4.2.DebuggingFlowChart..............................................................................................................4−2
4.3.Diagnosisapplication...............................................................................................................4−5
4.4.SystemDiagnosis....................................................................................................................4−7
4.5.HardwareTroubleshooting........................................................................................................4−8
4.5.1.LCD.........................................................................................................................4−8
4.5.2.ProblemsrelatedwithPower.........................................................................................4−9
4.5.3.Others.......................................................................................................................4−11
4.6.CPUFANControl....................................................................................................................4−14
4.7.Other.....................................................................................................................................4−16
4.8.H/WUpgrade..........................................................................................................................4−17
5.SystemWireDiagram........................................................................................................................5−1
5.1.SystemLayout........................................................................................................................5−1
5.2.SystemComponent..................................................................................................................5−3
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