Samsung RCD-750 - Page 10

3-6-2. Removing the Part
(1) Using special desoldering iron:
@ Select the tip according to the size and shape of
the IC.
@) Thin" the tip with a small amount of the IC leads.
@) Set the tip squarely over the IC leads.
@) When the solder melts, carefully twist the iron.
©) Raise and remove the IC.
(2) Using shaped airblower unit:
( Select the correct nozzle.
@) Select the temperature and airblow (suggested:
temperature: 7, airblow: 4)
@ Engage the IC removing tool.
@ Use the airblow to preheat the IC for about 5
seconds, then heat with the nozzle until the IC
remover lifts the part from the board.
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FIG. 7
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3-6-3. Installing the Part
(1) Use desoldering wire to remove the previous
older.
(2) Clean the location.
(3) Apply flux.
(4) Position the IC and solder two pins at opposite
sides.
(5) Use a sharp tipped soldering iron and carefully
solder each pin. (After graining experience, a
thicke tip can be used for better work efficiency.)
(6) Remove any solder bridges with desoldering wire.
(7) Inspect the work with a magnifier.