Samsung RCD-750 - Chip Component Handling Procedures

3-4. Chip Tantalum Capacitors and Chip
Filters
3-4-1. Kind of the Part
The kind of chip tantalum capacitors and chip filters
are as follows:
(1) Chip Inductors
(2) Chip Tantalum Capacitors
(3) Chip Tantalum Electrolytic Capacitors
(4) Chip Aluminum Electrolytic Capacitors
(5) Chip Transformers
(6) Chip Filters
3-4-2. Removing the Part
(1) Using special desoldering iron:
Select soldering tip according to part size.
@) Bring the tip into contact with the soldered points.
@) When the solder melts, remove the part.
@Remove the old solder with desoldering wire.
(1) Using two soldering irons:
CD Use small flat-blade tips.
@) Heat both ends of the part simultaneously.
@) When the solder melts, grasp and remove the part
with the soldering iron tips.
@ Remove the old solder with desoldering wire.
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3-4-3. Installing the Part
(1) Clean the area where the new part is to be
mounted.
(2) Apply flux
(3) In part correctly into position, prevent it from
shifting.
(4) Use sharp soldering iron tip. Bring close to the
part contact without actually touching it. Melt thin
solder between the tip and part so that if flows
into the part contact.
(5) Check work quality with a magnifier.
FIG. 5
3-5. Chip VRs, Chip Trimmer Capacitors,
Diodes and Tr.
3-5-1. Kind of the Part
The kind of the part is as follows:
(1) Chip VRs
(2) Chip Trimmer Capacitors
(3) Diode
(4) Transistors
3-5-2. Removing the Part
(1) Using two soldering irons:
@ Use small flat-blade tips.
@) Heat the leads of the part simultaneously.
@ When the solder melts, grasp and remove the part
with the soldering iron tips.
@ Remove the old solder with desoldering wire.
3-5-3. Installing the Part
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FIG. 6
(1) Clean the area where the new part is to be
mounted.
(2) Apply flux
(3) Set part correctly into position, prevent it from
shifting.
(4) Use sharp soldering iron tip. Bring close to the
part contact without actually touching it. Melt thin
solder between the tip and part so that it flows
into the part contact.
3-6. Chip ICs
3-6-1. The kind of the Chip ICs
The kind of the chip ICs are as follows:
(1) SOP (Small Outline Package) IC
(2) SSOP (Shrink Small! Outline Package) IC
(3) VSOP (Very Smail Outline Package) IC
(4) OFP (Quad Flat Package) IC
(5) VOFP (Very Quad Flat Package) IC
(6) PLCC (Plastic Leaded Chip Carrier) IC
(7) TSOP (Thin Small Outline Package) IC