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Siemens S55 - Addressbook Operations

Siemens S55
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V1.00 Page 28 of 49 ICM MP CCQ GRM
S55/S57 Company Confidential © Copyright Siemens AG 12/02
5.1.7 Vibration Motor
The vibration motor is mounted in the lower case. The electrical connection to the
PCB is realised with pressure contacts.
6 Power Supply
6.1 Power Supply ASIC
The power supply ASIC contains the following functions:
Powerdown-Mode
Sleep Mode
Trickle Charge Mode
Power on Reset
Digital state machine to control switch on and supervise the µC with a watchdog
Voltage regulator
Low power voltage regulator
Additional output ports
Voltage supervision
Temperature supervision with external and internal sensor
Battery charge control
TWI interface
I
2C interface
RC Oscillator
Audio multiplexer
Audio amplifier stereo/mono
18 bit Sigma/Delta DAC with Clock recovery
Bandgap reference*
INFO:
* Bandgap reference
The p-n junction of a semiconductor has a bandgap-voltage. This bandgap-voltage is
almost independent of changes in the supply voltage and has a very low temperature
gradient. The bandgap-voltage is used as reference for the voltage regulators.
To reduce the power dissipation of the ASIC and to ensure high efficiency of the
power management concept a DCDC Converter for the Core (EGOLD+V3 Baseband
Chipset), Flash and SRAM supply is used.
The DCDC converter includes the following functions:
PFM Mode for sleep mode of the Mobile Phone.
PWM Mode for active mode of the Mobile Phone.
The mode change is controlled by the ASIC with the signal EN_DC_DOWN based on
the EGOLD+ signal VCXO_EN.

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