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Siemens SL55 - 8 Acoustic; Microphone; Mechanical; Electrical

Siemens SL55
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Customer Care
V 1.0 Page 47of 52 ICM MP CCQ GRM
SL55
Company Confidential © Copyright Siemens AG
06/03
8 Acoustic
The buzzer and the keypad clicks will be realized over the earpiece. At normal buzzer the
signaling will realized with swelling tones. At the same time a maximum sound pressure
level in the coupler of 135 +/- 5dB(A) is fixed.
The standard sounds will be generated by the EGOLD+, the advanced sounds will be
generated via firmware running on the DSP.
8.1 Microphone
8.1.1 Mechanical
The microphone is built in the Mounting Frame Lower Part and is mechanically fixed with
a rubber seal (gasket). The contact on the PCB is realised via spiral springs, which are
integrated in the gasket. Because of usage of Unidirectional Microphone, the gasket has a
front- and a back sound-inlet hole. The front sound-inlet is acoustically tighten connected
with a sound-inlet at the rear-side of the mounting frame lower part. The back sound-inlet
is acoustically tighten connected with a sound-inlet at the bottom-side of the mounting
frame lower part. The gasket of the microphone has a asymmetrical shape in order to
provide non-rotating, guaranteed covering of the sound-inlets of mounting frame lower
part to the corresponding sound-inlets at microphone gasket.
8.1.2 Electrical
Both Microphones are directly connected to the EGOLD+.(Analog Interface G2, F1, G3, H2) via
the signals MICN1, MICP1 (Internal Microphone )and MICN2, MICP2 (External
Microphone/Headset). Power supply for the Microphone is VMIC (EGOLD+.(
Analog Interface
G1)
)

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