SimCom SIM7020E - Moisture Sensitivity Level (MSL); Baking Requirements

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SIM7020_Hardware_Design_V1.02 40 2018-07-25
6.3 Moisture Sensitivity Level (MSL)
SIM7020 is qualified to Moisture Sensitivity Level (MSL) 4 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
Table 32: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
stated
1
Unlimited at ≦30℃/85% RH
2 1 year
2a
4 weeks
3
168 hours
4 72 hours
5 48 hours
5a 24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.
6.4 Baking Requirements
SIM7020 modules are vacuum packaged, and guaranteed for 6 months storage without opening or
leakage under the following conditions: the environment temperature is lower than 40℃, and the air
humidity is less than 90%.
If the condition meets one of the following ones shown below, the modules should be baked
sufficiently before re-flow soldering, and the baking condition is shown in table below; otherwise the
module will be at the risk of permanent damage during re-flow soldering.
 If the vacuum package is broken or leakage;
 If the vacuum package is opened after 6 months since it’s been packed;
 If the vacuum package is opened within 6 months but out of its Floor Life at factory
ambient≦30℃/60%RH or as stated.
Table 33: Baking requirements
Baking temperature
Moisture
Time
40
℃
±5
℃
<5% 192 hours
120℃±5℃
<5% 4 hours