SimCom SIM7020E - Stencil Foil Design Recommendation

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SIM7020_Hardware_Design_V1.02 41 2018-07-25
Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken
out for preheating, and otherwise the tray may be damaged by high-temperature heating.
6.5 Stencil Foil Design Recommendation
The recommended thickness of stencil foil is 0.15mm.
Figure 27: Recommended SMT stencil footprint outline