Sony CFD-S01 - Servicing Overview; Servicing Notes and General Information; Disassembly Procedures; Adjustments

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CFD-S01
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Cabinet (Rear) Assy......................................................... 7
3-2. Cabinet (Front) Assy, Cabinet (Upper) Assy ................... 7
3-3. Main Board ...................................................................... 8
3-4. CD Block Assy ................................................................ 8
3-5. CD Motor Board.............................................................. 9
3-6. Optical Pick-up ................................................................ 9
3-7. Control Board .................................................................. 10
3-8. CD Lid ............................................................................. 10
3-9. Tape Mechanism Block, Belt (1), Belt (2) ...................... 11
3-10. TC Board ......................................................................... 11
3-11. Key (FUNC) Board, Key (VOL) Board .......................... 12
3-12. Power Board .................................................................... 12
4. MECHANICAL ADJUSTMENTS......................... 13
5. ELECTRICAL ADJUSTMENTS
Tape Section .................................................................... 13
Tuner Section................................................................... 14
CD Section ...................................................................... 16
6. DIAGRAMS
6-1. Block Diagram – CD Section – ....................................... 17
6-2. Block Diagram – Main Section – .................................... 18
6-3. Circuit Boards Location .................................................. 19
6-4. Schematic Diagram – Main Section (1/4) – .................... 20
6-5. Schematic Diagram – Main Section (2/4) – .................... 21
6-6. Schematic Diagram – Main Section (3/4) – .................... 22
6-7. Schematic Diagram – Main Section (4/4) – .................... 23
6-8. Printed Wiring Board – Main Section – .......................... 24
6-9. Printed Wiring Boards – TC Section – ............................ 25
6-10. Schematic Diagram – TC Section – ................................ 26
6-11. Printed Wiring Boards – Control Section – ..................... 27
6-12. Schematic Diagram – Control Section – ......................... 28
6-13. Printed Wiring Boards – Power Supply Section –........... 29
6-14. Schematic Diagram – Power Supply Section – ............... 30
7. EXPLODED VIEWS
7-1. Rear Cabinet Section ....................................................... 38
7-2. Front Cabinet Section (1) ................................................ 39
7-3. Front Cabinet Section (2) ................................................ 40
7-4. Upper Cabinet Section (1) ............................................... 41
7-5. Upper Cabinet Section (2) ............................................... 42
7-6. CD Mechanism Section ................................................... 43
8. ELECTRICAL PARTS LIST .................................. 44
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Ver. 1.1