Sony CFD-S03CP - SERVICING NOTES; GENERAL OPERATIONS; DISASSEMBLY AND ADJUSTMENTS; DIAGRAMS AND PARTS LIST

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CFD-S03CP/S03CPL
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Cabinet (Rear) Assy ......................................................... 7
3-2. Cabinet (Front) Assy, Cabinet (Upper) Assy ................... 7
3-3. Main Board ...................................................................... 8
3-4. CD Block Assy ................................................................ 8
3-5. BD83S Board .................................................................. 9
3-6. Optical Pick-up ................................................................ 9
3-7. Panel Board ..................................................................... 10
3-8. CD Lid ............................................................................. 10
3-9. Tape Mechanism Block, Belt (1), Belt (2) ...................... 11
3-10. TC Board ......................................................................... 11
3-11. Key-1 Board, Key-2 Board .............................................. 12
3-12. Power Board .................................................................... 12
4. MECHANICAL ADJUSTMENTS......................... 13
5. ELECTRICAL ADJUSTMENTS
Tape Section .................................................................... 13
Tuner Section ................................................................... 14
CD Section ...................................................................... 16
6. DIAGRAMS
6-1. Block Diagram – CD Section – ....................................... 17
6-2. Block Diagram – Main Section – .................................... 18
6-3. Circuit Boards Location .................................................. 19
6-4. Printed Wiring Board – BD83S Section – ....................... 20
6-5. Schematic Diagram – BD83S Section – .......................... 21
6-6. Printed Wiring Board – Main Section – .......................... 22
6-7. Schematic Diagram – Main Section (1/3) – .................... 23
6-8. Schematic Diagram – Main Section (2/3) – .................... 24
6-9. Schematic Diagram – Main Section (3/3) – .................... 25
6-10. Printed Wiring Boards – TC Section – ............................ 26
6-11. Schematic Diagram – TC Section – ................................ 27
6-12. Printed Wiring Boards – Panel Section – ........................ 28
6-13. Schematic Diagram – Panel Section – ............................ 29
6-14. Printed Wiring Boards – Power Supply Section – ........... 30
6-15. Schematic Diagram – Power Supply Section – ............... 31
7. EXPLODED VIEWS
7-1. Rear Cabinet Section ....................................................... 39
7-2. Front Cabinet Section (1) ................................................ 40
7-3. Front Cabinet Section (2) ................................................ 41
7-4. Upper Cabinet Section (1) ............................................... 42
7-5. Upper Cabinet Section (2) ............................................... 43
7-6. CD Mechanism Section ................................................... 44
8. ELECTRICAL PARTS LIST .................................. 45
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.