Sony D-NF430 - Page 30

Ref. No. Part No. Description Remark
Ref. No. Part No. Description Remark
30
D-NF430/NF431
MAIN
C883 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C891 1-119-750-11 TANTALUM CHIP 22uF 20% 6.3V
C892 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C893 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C895 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C896 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C897 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C898 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C899 1-107-820-11 CERAMIC CHIP 0.1uF 16V
CB605 1-112-063-11 CERAMIC CHIP 470PF 20% 50V
< FILTER/DISCRIMINATOR/VIBRATOR >
CF101 1-767-021-11 FILTER, CERAMIC
CF102 1-795-323-11 FILTER, CERAMIC
CF103 1-813-422-11 DISCRIMINATOR, CERAMIC
CF104 1-577-262-11 VIBRATOR, CRYSTAL (75kHz)
< CONNECTOR >
CN601 1-785-877-21 HOUSING, CONNECTOR 4P
CN602 1-784-342-21 HOUSING, CONNECTOR 2P
CN603 1-818-127-12 CONNECTOR, FFC/FPC (ZIF) 15P
CN604 1-778-158-51 CONNECTOR, FFC/FPC (ZIF) 10P
< TRIMMER >
CT101 1-141-615-21 CAP, ADJ
< DIODE >
D101 6-500-169-01 DIODE KV1610STL-G@1-2
D102 6-501-063-01 DIODE HV306CTRU-E (NF430: US)
D103 8-719-066-14 DIODE HSC277-TRF-E (NF430: US)
D104 8-719-066-14 DIODE HSC277-TRF-E (NF430: US)
D105 6-501-063-01 DIODE HV306CTRU-E
D106 6-501-063-01 DIODE HV306CTRU-E
D107 8-719-420-87 DIODE MA8130
D108 8-719-988-61 DIODE 1SS355TE-17
D202 8-719-059-53 DIODE MA3J14700LSO
D203 8-719-083-04 DIODE RSB6.8STE61
D204 8-719-083-04 DIODE RSB6.8STE61
D250 8-719-072-27 DIODE MA2Z748001S0
D251 6-500-540-01 DIODE RB521S-30FTE61
D402 6-500-483-01 DIODE MA22D2800LS0
D403 8-719-085-43 DIODE MA2YD2300LS0
D404 8-719-071-87 DIODE MA785- (TX), SO
D406 8-719-422-37 DIODE MA8051
D409 6-500-912-01 DIODE MA2SD3100LS0
D431 8-719-422-37 DIODE MA8051
D432 8-719-422-37 DIODE MA8051
D601 6-501-065-01 DIODE HVL375CMKRF-E
D602 6-501-065-01 DIODE HVL375CMKRF-E
D880 8-719-422-37 DIODE MA8051
D882 6-500-540-01 DIODE RB521S-30FTE61
< FUSE >
0F401 1-576-406-21 FUSE (1.4A/32V)
< FERRITE BEAD/JUMPER RESISTOR >
FB202 1-414-813-11 FERRITE, EMI (SMD) (2012)
FB203 1-414-813-11 FERRITE, EMI (SMD) (2012)
FB204 1-414-813-11 FERRITE, EMI (SMD) (2012)
FB205 1-414-813-11 FERRITE, EMI (SMD) (2012)
FB207 1-216-295-00 SHORT CHIP 0
FB208 1-216-864-11 SHORT CHIP 0
FB401 1-216-864-11 SHORT CHIP 0 (NF430: UK/NF431)
FB300 1-216-864-11 SHORT CHIP 0
FB301 1-218-990-11 SHORT CHIP 0
FB306 1-400-851-11 EMI, FERRITE (SMD) (1005)
FB800 1-216-864-11 SHORT CHIP 0 (NF430: UK/NF431)
FB800 1-469-667-21 FERRITE, EMI (SMD) (1608) (NF430: US)
FB801 1-400-851-11 EMI, FERRITE (SMD) (1005)
FB802 1-400-851-11 EMI, FERRITE (SMD) (1005)
FB803 1-400-851-11 EMI, FERRITE (SMD) (1005)
FB804 1-400-851-11 EMI, FERRITE (SMD) (1005)
FB805 1-481-073-11 EMI FERRITE (SMD) (1608)
< FILTER >
FL101 1-781-765-31 FILTER, BAND PASS (NF430: US)
FL102 1-236-711-21 FILTER, BAND PASS (NF430: UK/NF431)
< IC >
IC101 6-706-435-01 IC TB2132FNG
IC201 6-707-074-01 IC TB2173FTG
IC250 6-709-318-01 IC XC6367A303MRN
IC401 6-708-963-01 IC TB2169AFG (O)
IC603 6-707-398-01 IC XC6213B212NR
IC801 8-753-257-74 IC CXR721260-203R
IC802 6-702-355-01 IC AK6510CL-L
IC803 6-708-198-01 IC XC6219B272MR
IC841 6-708-198-01 IC XC6219B272MR
IC851 6-707-964-01 IC MSM56X16160J-20T3
< JACK >
J301 1-818-805-11 JACK (i) (NF430: US/NF431)
J301 1-818-810-21 JACK (i) (NF430: UK)
J401 1-816-936-41 JACK, DC (DC IN 3V)
< COIL/JUMPER RESISTOR >
L101 1-456-896-11 COIL, FERRITE-ROD ANTENNA
L103 1-456-899-11 COIL, AIR-CORE (NF430: US)
L104 1-456-898-11 COIL, AIR-CORE
L105 1-419-135-21 INDUCTOR 27nH
L106 1-469-846-11 INDUCTOR 47uH
L107 1-469-846-11 INDUCTOR 47uH
L108 1-469-846-11 INDUCTOR 47uH
L109 1-469-846-11 INDUCTOR 47uH
L250 1-481-063-11 INDUCTOR 22uH (4010)
L401 1-419-354-21 COIL, CHOKE 22uH
L402 1-400-145-21 INDUCTOR 47uH
L404 1-428-912-21 COIL, CHOKE 10uH
L405 1-400-145-21 INDUCTOR 47uH
L406 1-400-145-21 INDUCTOR 47uH
L407 1-400-145-21 INDUCTOR 47uH
L408 1-216-295-00 SHORT CHIP 0
L409 1-400-145-21 INDUCTOR 47uH
L410 1-500-451-11 FERRITE, EMI (SMD) (4516)(NF430: UK/NF431)
L411 1-500-451-11 FERRITE, EMI (SMD) (4516)(NF430: UK/NF431)
When MAIN board is replaced or EEPROM (IC802) on the MAIN board is
replaced, patch processing is needed.
Confirm about information of patch processing to each service headquarters.