Sony HCD-RG170 User Manual

SERVICE MANUAL
COMPACT DISC DECK RECEIVER
HCD-GX255/RG170/RG470
Ver. 1.2 2005.09
9-879-612-03
2005I05-1
© 2005.09
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
– Continued on next page –
Canadian Model
HCD-GX255
AEP Model
E Model
HCD-RG170/RG470
Australian Model
HCD-RG170
Photo: HCD-GX255
• HCD-GX255 is the amplifier, CD player, tape
deck and tuner section in MHC-GX255.
• HCD-RG170 is the amplifier, CD player, tape
deck and tuner section in MHC-RG170.
• HCD-RG470 is the amplifier, CD player, tape
deck and tuner section in MHC-RG470.
SPECIFICATIONS
Model Name Using Similar Mechanism NEW
CDM74KFS-F1BD81C (Except Mexican model) or
CD Mechanism Type CDM74KFS-K6BD83S (Canadian, AEP, East European, Russian, E2, E51 models)/
CD CDM74KFS-F1BD84 (Mexican model)
Section BU-F1BD81C (Except Mexican model) or
Base Unit Name BU-K6BD83S-WOD (Canadian, AEP, East European, Russian, E2, E51 models)/
BU-F1BD84 (Mexican model)
Optical Pick-up Block Name KSM-215DCP or KSM-213DCP
TAPE Model Name Using Similar Mechanism HCD-GX355/RG270
Section Tape Transport Mechanism Type CWM43FF13
Amplifier section
Canadian model:
HCD-GX255
Continuous RMS power output (reference):
65 + 65 watts (6 ohms at
1kHz, 10% THD)
Total harmonic distortion less than 0.07% (6 ohms at
1kHz, 40 W)
European and Russian models:
HCD-RG470
DIN power output (rated): 110 + 110 watts (6 ohms at
1kHz, DIN)
Continuous RMS power output (reference):
140 + 140 watts (6 ohms at
1kHz, 10% THD)
Music power output (reference):
280 + 280 watts (6 ohms at
1kHz, 10% THD)
HCD-RG170
DIN power output (rated): 20 + 20 watts (6 ohms at
1kHz, DIN)
Continuous RMS power output (reference):
25 + 25 watts (6 ohms at
1kHz, 10% THD)
Music power output (reference):
50 + 50 watts (6 ohms at
1kHz, 10% THD)
Other models:
HCD-RG470
The following measured at AC 120, 127, 220, 240 V
50/60 Hz
DIN power output (rated): 130 + 130 watts (6 ohms at
1kHz, DIN)
Continuous RMS power output (reference):
160 + 160 watts (6 ohms at
1kHz, 10% THD)
HCD-RG170
The following measured at AC 120, 127, 220, 240 V
50/60 Hz
DIN power output (rated): 50 + 50 watts (6 ohms at
1kHz, DIN)
Continuous RMS power output (reference):
65 + 65 watts (6 ohms at
1kHz, 10% THD)
Inputs
AUDIO IN (stereo mini jack):
voltage 250 mV,
impedance 47 kilohms
MIC (phone jack) (Latin American model only):
sensitivity 1 mV,
impedance 10 kilohms
Outputs
PHONES (stereo mini jack):
accepts headphones of
8ohms or more
VIDEO OUT (phono jack) (Mexican model only):
max. output level 1Vp-p,
unbalanced, Sync
negative, load impedance
75 ohms
SPEAKER: accepts impedance of 6 to
16 ohms
• Abbreviation
E2 : 120V AC area in E model
E51 : Chilean and Peruvian models

Sony HCD-RG170 Specifications

General

Power Output	100 W
CD Player	Yes
Radio Tuner	Yes
Tuner Bands	AM/FM
Bluetooth	No
USB Playback	No
USB Port	No
Cassette Deck	Yes
Speakers	2
Remote Control	Yes
Type	Mini Hi-Fi System
RMS Output Power	50W

Summary

SECTION 1 SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

Handling precautions for optical pick-up block to prevent electrostatic breakdown.

NOTES ON LASER DIODE EMISSION CHECK

Guidelines for safely checking the laser diode emission from the optical pick-up block.

LASER DIODE AND FOCUS SEARCH OPERATION CHECK

Procedure for checking laser diode and focus search operation using S curve.

DISCRIMINATION OF THE MAIN BOARD

Instructions for identifying different types of main boards used in the set.

MODEL IDENTIFICATION

Information on identifying the model based on the back panel label indication.

Abbreviation

List of abbreviations used for model destinations and regional variations.

SECTION 2 GENERAL

Location of Controls

Identifies and locates all controls and buttons on the main unit of the set.

BUTTON DESCRIPTIONS

Explains the function of various buttons found on the main unit.

Remote control

ALPHABETICAL ORDER

Lists remote control buttons alphabetically for easy reference.

BUTTON DESCRIPTIONS

Explains the functions of individual buttons on the remote control.

SECTION 3 DISASSEMBLY

3-1. DISASSEMBLY FLOW

Provides a step-by-step flow chart for disassembling the set.

3-2. CASE (TOP)

Instructions for removing the top case of the unit.

3-3. DOOR (CD)

Procedure for disassembling the CD door mechanism.

3-4. FRONT PANEL SECTION

Steps for removing and disassembling the front panel section.

3-5. MECHANICAL DECK (CWM43FF13)

Details on disassembling the mechanical CD deck mechanism.

3-6. CD MECHANISM DECK (CDM74KFS-F1BD81C (EXCEPT MX MODEL)/CDM74KFS-F1BD84 (MX MODEL))

Instructions for disassembling the CD mechanism deck, specifying model variations.

3-7. BACK PANEL SECTION

Procedure for accessing and removing the back panel section.

3-8. MAIN BOARD

Steps for disassembling and removing the main board.

3-9. BD BOARD/CD BOARD

Procedure for disassembling the BD board and CD board.

3-10. DRIVER BOARD, SW BOARD

Instructions for disassembling the driver board and SW board.

3-11. OPTICAL PICK-UP BLOCK (KSM-215DCP)

Steps for disassembling the optical pick-up block.

3-12. SENSOR BOARD

Procedure for disassembling the sensor board.

3-13. MOTOR (TB) BOARD

Instructions for disassembling the motor (TB) board.

3-14. MOTOR (LD) BOARD

Steps for disassembling the motor (LD) board.

SECTION 4 TEST MODE

MC COLD RESET

Clears all preset data to initial conditions; used when returning the set to the customer.

AM TUNING INTERVAL CHANGE-OVER

Allows changing the AM tuning interval between 9 kHz and 10 kHz.

CD SHIP (LOCK) MODE

Moves optical pick-up to a position durable to vibration for returning the set to the customer.

CD SHIP (LOCK) MODE & COLD RESET

Performs CD ship mode and cold reset simultaneously.

CD TRAY LOCK MODE

Mode to prevent sample disc removal from the tray in the shop.

AMP TEST MODE

Displays amplifier IC parameters and VACS status, allows adjustment.

SECTION 5 ELECTRICAL ADJUSTMENTS

CD SECTION

Contains adjustments and checks for the CD playback block.

S-CURVE CHECK

Procedure to confirm symmetrical S-curve waveform and peak-to-peak level.

RFAC LEVEL CHECK

Procedure to check the RFAC signal waveform and level for clear distinction.

SECTION 6 DIAGRAMS

6-1. BLOCK DIAGRAM – CD SERVO Section –

Illustrates the block diagram for the CD servo system.

6-2. BLOCK DIAGRAM – AUDIO/VIDEO Section –

Shows the block diagram for the audio and video signal processing sections.

6-3. BLOCK DIAGRAM – AMP Section –

Depicts the block diagram for the amplifier section, including power stages.

6-4. BLOCK DIAGRAM – PANEL, POWER SUPPLY Section –

Illustrates the block diagram for the panel controls and power supply circuits.

6-5. PRINTED WIRING BOARD – CD Board – (Except MX model)

Shows the component layout for the CD board (excluding MX model).

6-6. SCHEMATIC DIAGRAM – CD Board – (Except MX model)

Provides the schematic diagram for the CD board (excluding MX model).

6-7. PRINTED WIRING BOARD – BD Board – (MX model only)

Shows the component layout for the BD board (MX model only).

6-8. SCHEMATIC DIAGRAM – BD Board – (MX model only)

Provides the schematic diagram for the BD board (MX model only).

6-9. PRINTED WIRING BOARDS – CHANGER Section –

Shows the component layout for the changer section boards.

6-10. SCHEMATIC DIAGRAM – CHANGER Section –

Provides the schematic diagram for the changer section.

6-11. PRINTED WIRING BOARD – MAIN Board – (Suffix-11)

Shows the component layout for the MAIN board (Suffix-11).

6-12. SCHEMATIC DIAGRAM – MAIN Board (1/3) – (Suffix-11)

Provides the schematic diagram for the MAIN board (1/3) (Suffix-11).

6-13. SCHEMATIC DIAGRAM – MAIN Board (2/3) – (Suffix-11)

Provides the schematic diagram for the MAIN board (2/3) (Suffix-11).

6-14. SCHEMATIC DIAGRAM – MAIN Board (3/3) – (Suffix-11)

Provides the schematic diagram for the MAIN board (3/3) (Suffix-11).

6-15. PRINTED WIRING BOARD – MAIN Board – (Suffix-12)

Shows the component layout for the MAIN board (Suffix-12).

6-16. SCHEMATIC DIAGRAM – MAIN Board (1/3) – (Suffix-12)

Provides the schematic diagram for the MAIN board (1/3) (Suffix-12).

6-17. SCHEMATIC DIAGRAM – MAIN Board (2/3) – (Suffix-12)

Provides the schematic diagram for the MAIN board (2/3) (Suffix-12).

6-18. SCHEMATIC DIAGRAM – MAIN Board (3/3) – (Suffix-12)

Provides the schematic diagram for the MAIN board (3/3) (Suffix-12).

6-19. PRINTED WIRING BOARD – POWER Board – (GX255/RG170)

Shows the component layout for the POWER board (GX255/RG170).

6-20. SCHEMATIC DIAGRAM – POWER Board – (GX255/RG170)

Provides the schematic diagram for the POWER board (GX255/RG170).

6-21. PRINTED WIRING BOARD – POWER Board – (RG470: AEP, EE, RU)

Shows the component layout for the POWER board (RG470: AEP, EE, RU).

6-22. SCHEMATIC DIAGRAM – POWER Board – (RG470: AEP, EE, RU)

Provides the schematic diagram for the POWER board (RG470: AEP, EE, RU).

6-23. PRINTED WIRING BOARD – POWER Board – (RG470: E2, E51, AR, MX)

Shows the component layout for the POWER board (RG470: E2, E51, AR, MX).

6-24. SCHEMATIC DIAGRAM – POWER Board – (RG470: E2, E51, AR, MX)

Provides the schematic diagram for the POWER board (RG470: E2, E51, AR, MX).

6-25. PRINTED WIRING BOARDS – AUDIO IN, MIC, HEADPHONE Boards –

Shows the component layout for the audio in, mic, and headphone boards.

6-26. SCHEMATIC DIAGRAM – AUDIO IN, MIC, HEADPHONE Boards –

Provides the schematic diagram for the audio in, mic, and headphone boards.

6-27. PRINTED WIRING BOARDS – CD-G Section – (MX model only)

Shows the component layout for the CD-G section (MX model only).

6-28. SCHEMATIC DIAGRAM – CD-G Section – (MX model only)

Provides the schematic diagram for the CD-G section (MX model only).

6-29. PRINTED WIRING BOARD – PANEL Section (1/2) –

Shows the component layout for the panel section (1/2).

6-30. PRINTED WIRING BOARD – PANEL Section (2/2) –

Shows the component layout for the panel section (2/2).

6-31. SCHEMATIC DIAGRAM – PANEL Section (1/2) –

Provides the schematic diagram for the panel section (1/2).

6-32. SCHEMATIC DIAGRAM – PANEL Section (2/2) –

Provides the schematic diagram for the panel section (2/2).

6-33. PRINTED WIRING BOARDS – TRANS Section – (GX255/RG170)

Shows the component layout for the TRANS section (GX255/RG170).

6-34. SCHEMATIC DIAGRAM – TRANS Section – (GX255/RG170)

Provides the schematic diagram for the TRANS section (GX255/RG170).

6-35. PRINTED WIRING BOARDS – TRANS Section – (RG470: AEP, EE, RU)

Shows the component layout for the TRANS section (RG470: AEP, EE, RU).

6-36. SCHEMATIC DIAGRAM – TRANS Section – (RG470: AEP, EE, RU)

Provides the schematic diagram for the TRANS section (RG470: AEP, EE, RU).

6-37. PRINTED WIRING BOARDS – TRANS Section – (RG470: E2, E51, AR, MX)

Shows the component layout for the TRANS section (RG470: E2, E51, AR, MX).

6-38. SCHEMATIC DIAGRAM – TRANS Section – (RG470: E2, E51, AR, MX)

Provides the schematic diagram for the TRANS section (RG470: E2, E51, AR, MX).

SECTION 8 ELECTRICAL PARTS LIST

Abbreviation

List of abbreviations used for model destinations and regional variations.

SECTION 7 EXPLODED VIEWS

7-1. OVERALL SECTION

Exploded view of the overall unit, showing major assemblies and parts with reference numbers.

7-2. BACK PANEL SECTION

Exploded view detailing parts of the back panel section.

7-3. FRONT PANEL SECTION

Exploded view of the front panel section, including controls and display elements.

7-4. KEY SECTION

Exploded view detailing the various keys and their mounting on the panel.

7-5. CHASSIS SECTION

Exploded view illustrating the internal chassis structure and component placement.

7-6. TRANSFORMER SECTION

Exploded view showing the transformer board and related components.

7-7. CD MECHANISM DECK SECTION-1 (CDM74KFS-K6BD83S)

Exploded view of the CD mechanism deck, first part, detailing its components.

7-8. CD MECHANISM DECK SECTION-2 (CDM74KFS-K6BD83S)

Second part of the exploded view for the CD mechanism deck, showing detailed components.