Sony ICF-SW22 - Page 7

ICF-SW22
SECTION 4 4-1. PRINTED WIRING BOARDS
DIAGRAMS
L14 MW FERRITE-ROO ANT
@ SEMICONDUCTOR
LOCATION
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* O— : parts extracted from the component side.
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B-9
* @—-: parts extracted from the conductor side. A-8 T
‘ — ‘es o-— 4
* Hs: parts mounted on the conductor side. C-7 1 ‘ a
|
* @ _ : Through hole. C-8 a
o: : : Pattern on the side which is seen. B-3 epee eres
ae : | Pattern of the rear side. r --o12
. : D-8 1 are}
. CL] : Chip components extracted from the rear side. A-2 { } |
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F-8 s Cates} |
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SELECTR OUTPUT
BUFFER
PULSE
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CONTROL
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FRONT END
@ SEMICONDUCTOR LEAD LAYOUTS
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