Sony MDS-E12 - SECTION 5 DIAGRAMS; 5-1. Circuit Boards Location; THIS NOTE IS COMMON FOR WIRING BOARDS AND SCHEMATIC DIAGRAMS; For Schematic Diagrams

5-1. CIRCUIT BOARDS LOCATION
AC board
BD board
PSW board
SIRCS board
FL board
KEY board
7UY bE, BBR —b
GRY —b
© FRAY, BLOWERS ALF LY, ME SOV EIFO
APIO
Raa,
FLIAMHO
MMR
CHE
DBA,
REECE
SOK,
BECBATT.
GE
>
T
SCHARF
Ie,
BOs, 4 OME & Bi, MTN T pw F (p is pF).
Ei CHRO SWUSOld, 1/4WUF ERT,
HBMSTXTO,
Qa > ARE
(ot NA IRARE AR
(B+74~>,
1B-JTtyY.
DFE O Bi € BAL TF EU,
C=] : Aa,
BESLURB, WP’ -ARME REESE CHE.
fe Fl : feb
( ) tFARF 4AM (TDYS1) EB
* 1 RIE ART SE RR
Belt, FAS (ANT YE-FLYAIMA/VW) G
Hie LLSBE,
RE, FY OAZI-TPCHELESER,
OSS LRM ORSES,
© ESORNICOWT
D > BE
BW : 8
D> ‘Be (FY SIHA)
BQ RE (FV ANA)
FUL KRY —b
e
o—— ? BAER OU — KR
wesc (SFL TUS AMD ISS — >
(HONS —HDUTERRE NECA)
SECTION 5
DIAGRAMS
CNT board
MAIN board
BAL board
HP board
THIS NOTE IS COMMON FOR WIRING BOARDS
AND SCHEMATIC DIAGRAMS
For schematic diagrams
* All capacitors are in yF unless otherwise noted. pF : pF. 50V or
less are not indicated except for electrolytics and.tantalums.
* Allresistors except chips are in Q and ‘/,W or less Unless otherwise
specified.
°° A : internal component.
* [2] : panel designation
° : B+ Line
° : B-Line
Note: Note:
The components identi- | Les composants identifiés par
fied by mark A\ or dotted | une marque A\ sont critiques
fine with mark Aare criti- | pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part | piéce portant le numéro
number specified. spécifié.
¢ [-) : adjustment for repair.
Voltage and waveforms are dc with respect to ground under no-
signal (detuned) conditions.
no mark : STOP
( ) : Play the test disc (TDYS-1).
** : can not be measured,
Voltages are taken with a VOM (input impedance 10 MQ).
Voltage variations may be noted due to normal production
tolerances.
eoeees
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
Circled numbers refer to waveforms.
¢ Signal path.
»») : PB
B : REC
x» : PB (Digital out)
By : REC (Digital in)
For printed wiring boards
* o——— : parts extracted from the component side.
: Pattern on the side which is seen.
(Other patterns are not shown.)