– 2 –
TABLE OF CONTENTS
1. GENERAL .................................................................. 3
2. DISASSEMBLY ......................................................... 4
3. TEST MODE.............................................................. 5
4. DIAGRAMS ................................................................. 6
4-1. Notes for Printed Wiring Board
and Schematic Diagram .................................................. 7
4-2. Printed Wiring Board – MAIN Section – ...................... 11
4-3. Schematic Diagram – MAIN Section (1/2) –................ 13
4-4. Schematic Diagram – MAIN Section (2/2) –................ 15
4-5. Printed Wiring Boards – PANEL Section – .................. 17
4-6. Schematic Diagram – PANEL Section – ....................... 19
4-7. Printed Wiring Boards – POWER Section – ................. 21
4-8. Schematic Diagram – POWER Section – ..................... 23
4-9. IC Pin Function Description ........................................... 25
5. EXPLODED VIEWS ................................................ 27
6. ELECTRICAL PARTS LIST ............................... 29
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY A ! MARK ON THE SCHEMATIC
DIAGRAMS, EXPLODED VIEWS AND IN THE PARTS LIST ARE
CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR
AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.