4-4
• An initial evacuation lid/lock sequence (automatic)
• Purge cycle
• Valve timing/actuation(s)
• Temperature ramp(s) at programmed rate(s)
• Vacuum bake at a programmed time/temperature
• Backfill to a set pressure at a specific time
• Dwell for a set time/temperature
• Forced cooling after solidification
• Lid open sequence (automatic)
The following process steps are for performing a lid sealing operation using
Gold/Tin solder. On the following page a programming sequence has been
developed to illustrate the line by line/step by step procedure. Additional blank
sheets at the end of this section are included for copying and creating practice
profiles.
1. Evacuate the chamber for 40 seconds.
2. Backfill the chamber to 10 psig.
3. Purge with H
2
for 30 seconds.
4. Vent the chamber to 0 psig.
5. Initial vacuum for one minute.
6. Perform a vacuum bake, ramp from room temperature to 240 ºC in 1:30
minute, hold for 2 minutes.
7. Backfill the chamber to 4 psig.
8. Perform the final seal; ramp from 240 ºC to 325 ºC in 60 seconds, hold
for 2 minutes.
9. Allow the solder to cool below the melting point.
10. Force cool to a safe handling temperature.
4.7 Optional Computer Software (Watview)
An optional computer software package (SW-1) is available for use with the
Model 1200. This software package provides the following features:
• Profile creation and editing
• Profile storage (on PC)
• Real time profile display
• Data logging
A Windows-based PC is required to operate this software package, together with
a serial communications cable to connect the PC to the Model 1200.
Detailed instructions on operation of the software package are included in the
Watview User Manual. The user is encouraged to read this documentation for
complete software features and instructions. Basic installation and usage
instructions, as they apply to software use with the Model 1200, are provided
below.
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