Operations Model 6DS-SP Planarizer
3 - 48 Version 4.0 - February 1998
5 - RUN AN AUTO POLISH CYCLE
Assumptions - The procedures below were written with the
assumptions that:
• The operator has powered up the machine and performed the home
sequence routine.
• The operator has installed the polishing pad, wafer backings, and
wafer template rings. (See the Operator Routine Maintenance
section, below in this chapter, for procedures).
• The operator has placed the carriers on the spindles.
• Per instructions from the process engineer or supervisor, the
operator has retrieved or confirmed the recipe parameters.
Note: The procedure below runs a standard auto polish cycle with no
feature options selected at the Auto Polish Cycle Menu. For details
on options selectable at the Auto Polish Cycle Menu, refer to Menus
Used in Basic Operation, above in this chapter.
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