Strasbaugh Operator Functions
Version 4.0 - February 1998 3 - 51
OPERATION USING MANUAL
LOADING OF WAFERS
Follow the procedure below to manually load wafers during an auto polish
cycle rather than using the automated wafer handling (cassette and elevator)
system detailed in the Basic Operation section of this chapter (above).
Manual loading of wafers may be desirable for short polish runs or for
maintenance of production in the event of a failure of the wafer handling
system.
SUMMARY
The list below is a summary of the procedures needed to start up the
machine and complete an auto polish cycle using the manual wafer loading
option.
1. Power Up.
2. Perform Home Sequence Routine.
3. Place Carriers on Spindles.
4. Retrieve a Stored Recipe.
5. Run Auto Polish Cycle Using the “Start With Load”
Feature.
Assumptions - The procedures below were written with the assumptions
that:
• The operator has read the Basic Operation section of this
chapter (above).
• The operator has installed the polishing pad, wafer backings,
and wafer template rings. (See the Operator Routine
Maintenance section, below, for procedures).
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