Operations Model 6DS-SP Planarizer
4 - 30 Version 4.0 - February 1998
Item Function(s)
Carrier Cleaning Time
(Single table machines only) Sets the time the
carriers will be rotated and rinsed during cleaning.
Carrier Cleaning Device
Enbl/Dsbl
(Single table machines only) The cleaning device
will be raised against the carrier during cleaning.
However, it will be lowered 12 seconds before
cleaning is finished to allow unrestricted rinsing.
Post Polish Wafer Clean
Enbl/Dsbl
(Single table machines only) Wafers will be
cleaned while on the carrier after each polish cycle.
Wafer Cleaning Time
(Single table machines only) Sets the time the
carriers will be rotated and wafer rinsed during
wafer cleaning.
Wafer Cleaning Device
Enbl/Dsbl
(Single table machines only) The cleaning device
will be raised against the wafer during wafer
cleaning. However, it will be lowered 12 seconds
before cleaning is finished to allow some final
unrestricted rinsing.
ADDITIONAL FEATURES AT THE CONDITIONING/CLEANING
PARAMETERS MENU
IN-SITU CONDITIONING DUTY CYCLE:
The percentage of time conditioning occurs during polishing can be set with
the In-situ Duty Cycle value in the Conditioning/Cleaning Parameters
Menu. The arm is raised and conditioning is paused the required time after
each complete 2 way sweep to effect the duty cycle. If the duty cycle is set to
100%, in-situ conditioning will be continuous. If set to 0%, there will be one
2 way sweep after which the arm will raise and pause indefinitely. (In-situ
conditioning always starts when polishing starts.)
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