Operations Model 6DS-SP Planarizer
4 - 42 Version 4.0 - February 1998
The Odd Wafer Time Adjust can be used to lengthen or shorten the polish
times for the odd wafer polish cycle. All times for both tables will be
multiplied by this value which is entered as a percent. 100 % is the nominal
value and will cause no change to polish times. During odd wafer polishing,
the adjusted times will show on the Auto Polish Menu.
POLISH AND CONDITION FORCE UNITS AND DIAMETER
ENTRY CHANGE:
Polish and conditioning force units and wafer diameter and conditioning
device diameter are entered in the Machine Parameters Menu and
Conditioning/Cleaning Parameters Menu respectively.
This permits the units and diameters to be saved as part of the recipe.
The diameter is not used if "lbs" is used for force. If "psi" is used and zero is
entered for the diameter, displays will show "Wfr Dia?" or "Dev Dia?" to
warn that no diameter is entered.
Also, if changing between "lbs" and "psi", no recipe values will be changed.
For example, 7 psi would become 7 lbs if the units were changed.
WET IDLE SLURRY FLUSH:
A wet idle slurry flush can be enabled/disabled in the Machine Parameters
Menu.
If enabled, one slurry flush cycle will occur when wet idling begins. The wet
idle slurry flush will use the choices from the Slurry Flush Menu.
POST POLISH SLURRY FLUSH:
If Post Polish Slurry Flush is set to Enable in the Machine Parameters
Menu, a slurry flush cycle will occur after each polishing cycle according to
the setup in the Slurry Flush menu. If post polish pad conditioning is being
used, the flush cycle will occur after the pad conditioning cycle.
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