Strasbaugh 6DS-SP - Page 494

Maintenance Model 6DS-SP Planarizer
8 - 4 Version 4.0 - February 1998
DAILY PREVENTIVE
MAINTENANCE SCHEDULE
SUBJECT ACTION
• Carrier/Wafer Cleaning Stations
• Carriers
• Dial Pressure Gauge Readings
• Elevator Tanks
• Machine Cabinet and Surfaces
• Polish Pad
• Polish Table and Splash Ring
• Robot Vacuum Chuck
Wipe down inside and out, removing
residue.
Clean and inspect wafer template rings
for damage each time the wafer backing
film is changed or each time a wafer
comes out of the carrier on the table
during processing.
Check carrier pocket depth each time
wafer backing film or template ring is
replaced.
Check for proper readings for
compressed air, chuck air blow off, chuck
vacuum, DI water flow, spindle raise
pressure, spindle blow off, and slurry
diaphragm pumps.
Wipe down inside.
Wipe down inside and out, removing
residue.
Inspect and change each shift.
Clean, removing residue.
Clean:
(1) Pull vacuum line off stainless steel
tube and make sure tube is clear.
(2) Lift chuck out of end effector.
(3) Gently scrape off slurry residue.
(4) Wipe clean.
(5) Replace in end effector.
(6) Replace vacuum line.