Maintenance Model 6DS-SP Planarizer
10 - 48 Version 4.0 - February 1998
d. When the goal has been met, go on to Sweep Parameters Setup,
below.
C. SWEEP PARAMETERS SETUP
1. Determine the endpoints of the desired arm sweep in terms of the
distance in inches from the table center to the center of the
conditioning device.
• As this will probably involve such process-related issues as wafer
diameter, oscillation stroke, and conditioning device diameter, refer
to the process supervisor.
2. At the Sweep Parameters Menu, enter the two endpoints as the Outer
and Inner values.
The Outer value must be the larger of the two values.
3. Before running an auto polish cycle, reselect the polish recipe.
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