Maintenance Model 6DS-SP Planarizer
10 - 86 Version 4.0 - February 1998
3. Measure the distance between the edge of the wafer and the edge of the
vacuum chuck at three equidistant points around the wafer.
WAFER
CENTERING
GOAL:
The three measurements should be within .0312 in. of
equal.
a. If the measurements meet the goal, indicating the wafer is centered
under the chuck, skip to Step 6., below.
b. If the measurements do not meet the goal, go to Step 4.,
immediately below, to correct the wafer’s position.
4. Select End Effector On/Off and choose Off to turn robot end effector
vacuum "off", releasing the test wafer.
5. Repeat the centering procedure:
a. Repeat Steps 1. through 3. until the Wafer Centering Goal is met.
b. When the goal has been met, go on to Step 6.
6. With the test wafer centered under the vacuum chuck, use a felt pen to
carefully draw an outline of the robot arm on the wafer.
You will use the outline on this wafer as an alignment guide (target)
during the remainder of this procedure.
7. Follow Step 4., above, to turn vacuum off and remove the guide wafer
from the robot end effector.
C. CHECK THE CURRENT CALIBRATION
1. With the “H bar” of a cassette facing up, place the alignment guide
wafer (with its target facing up) in the top slot (slot 1) of the cassette.
Note: Be sure the guide wafer is pushed to the rear of the cassette.
2. Place the cassette on the left send elevator.
3. Lower the cassette arm.
4. Select Robot Move and choose Left Send to move the robot to the left
send station.
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