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Strasbaugh 6DS-SP - Page 788

Strasbaugh 6DS-SP
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Strasbaugh Software Calibration Procedures
Version 4.0 - February 1998 10 - 97
C. CENTER A TEST WAFER UNDER THE ROBOT VACUUM
CHUCK
1. At Page 1 of the Manual Control Menu, select End Effector On/Off and
choose On to turn robot end effector vacuum "on".
2. Taking care to center the wafer under the chuck, manually hold a test
wafer under the robot arm end effector vacuum chuck until the wafer
takes vacuum.
3. Measure the distance between the edge of the wafer and the edge of the
vacuum chuck at three equidistant points around the wafer.
WAFER
CENTERING
GOAL:
The three measurements should be within .0312
in. of equal.
a. If the measurements meet the goal, indicating the wafer is centered
under the chuck, skip to Check Current Calibration, below.
b. If the measurements do not meet the goal, go to Step 4.,
immediately below, to correct the wafers position.
4. Repeat the centering procedure:
a. Repeat Steps 1. through 3. until the Wafer Centering Goal is met.
b. When the goal has been met, go on to Check the Current
Calibration, immediately below.

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