Maintenance Model 6DS-SP Planarizer
10 - 116 Version 4.0 - February 1998
Turn Machine Power On, Perform Home Sequence Routine, and Install Carriers
on Spindles
Follow the procedures detailed in the Operator Functions chapter of the 6DS-SP
Operations manual.
B. PROCEDURE
1. Load 50 test wafers into two cassettes.
2. Place one loaded cassette on each send elevator.
3. Lower both cassette arms.
4. Place an empty cassette on each receive elevator and lower both cassette
arms.
5. Following the procedures found in the Operator Functions and Machine
Setup chapters of the 6DS-SP Operations manual, set the polish time
for both spindles to 0.
6. Run an auto polish cycle:
• Follow the procedures detailed in the Operator Functions chapter of
the 6DS-SP Operations manual.
7. Observe wafer handling as the 50 wafers are processed and placed in the
receive cassettes.
GOALS:
1. The robot moves the wafers in and out of the cassettes
without missing any wafers
and
2. without clanking any wafers into the cassettes.
3. The robot does not pull any wafers out of the receive
cassettes when the robot arm returns to its zero position.
4. All 50 test wafers are processed with no dropping,
breaking, or mishandling.
• If needed, repeat the elevator and robot calibration procedure series
until 50 test wafers can be processed with no dropping, breaking, or
mishandling.