Maintenance Model 6DS-SP Planarizer
11 - 30 Version 4.0 - February 1998
Set Auto Polish Cycle Parameters for Short Test Cycle
Refer to Running a Short Test Cycle, found in the Overview section of the
Mechanical Maintenance Procedures chapter of this manual.
B. CHECK CURRENT ADJUSTMENT
1. Prepare to run an auto polish cycle:
a. Place two to four wafers in a wafer cassette.
b. Place the cassette on the left send elevator. Lower the elevator
cassette sensor arm to the top of the cassette.
c. Place an empty cassette on the left receive elevator. Lower the
elevator cassette sensor arm to the top of the cassette.
d. Wet the polish table pad and carrier inserts with the sprayer.
2. Following the procedures found in the Operator Functions and Machine
Setup chapters of the 6DS-SP Operations manual, set the polish time
for both spindles to 0.
3. Initiate a test cycle and observe the motion of the spindles:
GOAL: The spindles should move down slowly and at
approximately the same speed. (During an auto cycle,
the carriers should touch the table at the same time.)
a. Note the following:
• Do the spindles come down too fast?
• If one spindle comes down ahead of the other, which comes
first?
b. Start the cycle, observe, and “finish” the cycle by follow the
procedures detailed in the Operator Functions chapter of the 6DS-
SP Operations manual.
c. If the goal is met, no adjustment is required.
d. If the goal is not met, correct the motion by following the
procedures in Section C., immediately below.
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