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Supermicro X11DPX-T - Attaching the Processor Package Assembly to the Heatsink to Form the Processor Heatsink Module (PHM)

Supermicro X11DPX-T
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30
Super X11DPX-T User's Manual
Attaching the Processor Package Assembly to the Heatsink to
Form the Processor Heatsink Module (PHM)
After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly onto
the heatsink to create the Processor Heatsink Module (PHM).
1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.
With your index nger pressing against the screw at this triangular corner, carefully hold
and turn the heatsink upside down with the thermal-grease side facing up. Remove the
protective thermal lm if present, and apply the proper amount of the thermal grease
as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)
2. Holding the processor package assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and
a larger hole at the diagonal corner of the same (reverse) side of the processor carrier
assembly ("b" in the graphic).
3. With the back of heatsink and
the reverse side of the processor
package assembly facing up,
align the triangular corner on
the heatsink ("A" in the graphic)
against the mounting clips next
to the hollow triangle ("a") on the
processor package assembly.
4. Also align the triangular corner
("B") at the diagonal side of the
heatsink with the corresponding
clips on the processor package
assembly ("b").
5. Once the mounting clips on the
processor package assembly
are properly aligned with the
corresponding holes on the back
of heatsink, securely attach
the heatsink to the processor
package assembly by snapping the
mounting clips at the proper places
on the heatsink to create the
processor heatsink module (PHM).
Heatsink
(Upside Down)
Non-Fabric CPU and Processor Clip
(Upside Down)
C
D
d
c
a
b
A
B
On Locations of (C, D), the notches
snap onto the heat sink’s
mounting holes
On Locations (A, B), the notches
snap onto the heatsink’s sides
A
B
D
C
Make sure Mounting
Notches snap into place
Triangle on the CPU
Triangle on the
Processor Clip

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