144 Disassembly and Reassembly TM8100/TM8200 Service Manual
© Tait Electronics Limited November 2007
4. If the thermal paste on the heat-transfer block F or the tin-plated
cooper plate of the main board
1$ has been contaminated, new
thermal paste must be applied:
■ Remove any residue of the old thermal paste from both contact
surfaces.
■ Use Dow Corning 340 silicone heat-sink compound
(IPN 937-00000-55).
Important Ensure that no bristles from the brush come loose and
remain embedded in the paste. The paste needs to be
completely free of contaminants.
■ Use a stiff brush to apply 0.1cm
3
of thermal paste over the
complete contact surface on the tin-plated copper plate (refer to
Figure 5.6 on page 143).
5. Place the main board
1$ in position on the heat-transfer block F, and
push them together to spread the thermal paste.
Important You must observe the following order of assembly to ensure
that the main board and the connectors are not assembled
under stress.
6. Use a torque-driver with a 3/16 inch (5mm) socket to fasten the
D-range screwlock fasteners
H to 8lb·in (0.9N·m).
7. Fit the RF connector lock washer
1@. Use a torque-driver with a
9/16 inch (14mm) long-reach socket to fasten the RF connector nut
1! to 15lb·in (1.7N·m).
8. Use a torque-driver with a Torx T10 bit to fasten the three screws
b
to 15lb·in (1.7N·m).
9. Loosen both the D-range screwlock fasteners
H and the
RF connector nut
1!.
10. Re-tighten both the D-range screwlock fasteners
H and the
RF connector nut
1! to the torques indicated in steps 7 and 8.
11. Fit the power connector seal
I.
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