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PACKAGE OUTLINE
C
TYP
8.3
7.9
30X 0.65
32X
0.30
0.19
2X
9.75
(0.15) TYP
0 - 8
0.15
0.05
1.2 MAX
3.04
2.46
3.74
3.16
0.25
GAGE PLANE
0.75
0.50
A
NOTE 3
11.1
10.9
B
6.2
6.0
2X (0.6)
NOTE 5
2X (0.15)
NOTE 5
PowerPAD TSSOP - 1.2 mm max heightDAP0032C
PLASTIC SMALL OUTLINE
4223691/A 05/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may differ and may not be present.
PowerPAD is a trademark of Texas Instruments.
TM
1
32
0.1 C A B
17
16
PIN 1 ID AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.500
EXPOSED
THERMAL PAD
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