Texas Instruments TPA31 D2 Series - User Manual

LC Filter
LC Filter
Left
Right
4.5 V-26 V
PSU
Tuner AM/FM
CD/ MP3
Aux in
Left
Right
Audio Processor
And control
TPA3116D2
AM /FM Avoidance
Control
FAULTZ
SDZ
MUTE
Sync
Capable of synchronizing to other devices
GAIN/SLV
GAIN control and Master /Slave setting
AM2,1,0
PLIMIT
Power Limit
PBTL
Detect
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA3116D2 , TPA3118D2 , TPA3130D2
SLOS708G –APRIL 2012–REVISED DECEMBER 2017
TPA3116D2 15-W, 30-W, 50-W Filter-Free Class-D Stereo Amplifier Family With AM
Avoidance
1
1 Features
1
• Supports Multiple Output Configurations
– 2 × 50 W Into a 4-Ω BTL Load at 21 V
(TPA3116D2)
– 2 × 30 W Into a 8-Ω BTL Load at 24 V
(TPA3118D2)
– 2 × 15 W Into a 8-Ω BTL Load at 15 V
(TPA3130D2)
• Wide Voltage Range: 4.5 V to 26 V
• Efficient Class-D Operation
– >90% Power Efficiency Combined With Low
Idle Loss Greatly Reduces Heat Sink Size
– Advanced Modulation Schemes
• Multiple Switching Frequencies
– AM Avoidance
– Master and Slave Synchronization
– Up to 1.2-MHz Switching Frequency
• Feedback Power-Stage Architecture With High
PSRR Reduces PSU Requirements
• Programmable Power Limit
• Differential and Single-Ended Inputs
• Stereo and Mono Mode With Single-Filter Mono
Configuration
• Single Power Supply Reduces Component Count
• Integrated Self-Protection Circuits Including
Overvoltage, Undervoltage, Overtemperature, DC-
Detect, and Short Circuit With Error Reporting
• Thermally Enhanced Packages
– DAD (32-Pin HTSSOP Pad Up)
– DAP (32-Pin HTSSOP Pad Down)
• –40°C to 85°C Ambient Temperature Range
2 Applications
• Mini-Micro Component, Speaker Bar, Docks
• After-Market Automotive
• CRT TV
• Consumer Audio Applications
3 Description
The TPA31xxD2 series are stereo efficient, digital
amplifier power stage for driving speakers up to 100
W / 2 Ω in mono. The high efficiency of the
TPA3130D2 allows it to do 2 × 15 W without external
heat sink on a single layer PCB. The TPA3118D2 can
even run 2 × 30 W / 8 Ω without heat sink on a dual
layer PCB. If even higher power is needed the
TPA3116D2 does 2 × 50 W / 4 Ω with a small heat-
sink attached to its top side PowerPAD. All three
devices share the same footprint enabling a single
PCB to be used across different power levels.
The TPA31xxD2 advanced oscillator/PLL circuit
employs a multiple switching frequency option to
avoid AM interferences; this is achieved together with
an option of either master or slave option, making it
possible to synchronize multiple devices.
The TPA31xxD2 devices are fully protected against
faults with short-circuit protection and thermal
protection as well as overvoltage, undervoltage, and
DC protection. Faults are reported back to the
processor to prevent devices from being damaged
during overload conditions.
Device Information
(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TPA3116D2 DAD (32) 11.00 mm × 6.20 mm
TPA3118D2
TPA3130D2
DAP (32) 11.00 mm × 6.20 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Application Circuit

Texas Instruments TPA31 D2 Series Specifications

General

Type	Class-D
Channels	2
Output Power per Channel	Up to 30 W
Supply Voltage Range	8V to 26V
Operating Temperature Range	-40°C to 85°C
THD+N	0.1%
Shutdown Current	1µA
Efficiency	90%

Summary

1 Features

Supports Multiple Output Configurations

Device configurations for different load conditions.

Efficient Class-D Operation

High power efficiency and reduced heat sink requirements.

Integrated Self-Protection Circuits

Protection against overvoltage, undervoltage, overtemperature, DC-detect, and short circuit.

2 Applications

Consumer Audio Applications

General use in consumer audio devices and systems.

3 Description

High-efficiency digital amplifier power stage

High-efficiency digital amplifier power stage for driving speakers.

Integrated Self-Protection Circuits

Protection against various fault conditions for device reliability.

4 Revision History

Changes from Revision F (February 2017) to Revision G

Details changes made in revision G compared to revision F.

5 Pin Configuration and Functions

DAD Package

Pin configuration for the 32-Pin HTSSOP DAD package, top view.

DAP Package

Pin configuration for the 32-Pin HTSSOP DAP package, top view.

6 Specifications

6.1 Absolute Maximum Ratings

Specifies voltage, current, and temperature limits for safe operation.

6.3 Recommended Operating Conditions

Lists operating parameters like supply voltage, input levels, and impedance.

6.4 Thermal Information

6.5 DC Electrical Characteristics

Lists DC parameters such as offset voltage, quiescent current, and gain.

6.6 AC Electrical Characteristics

6.7 Typical Characteristics

7 Detailed Description

7.1 Overview

Introduces the TPA31xxD2 as a high-efficiency Class D audio amplifier.

7.2 Functional Block Diagram

Illustrates the internal functional blocks of the amplifier.

7.3 Feature Description

Details various features and operational aspects of the device.

7.3.2 Input Impedance

7.3.3 Startup and Shutdown Operation

7.3.4 PLIMIT Operation

7.3.8 Device Protection System

7.3.9 DC Detect Protection

Explains the DC detect protection for speakers and fault reporting.

7.3.10 Short-Circuit Protection and Automatic Recovery Feature

Describes short-circuit protection and methods for automatic recovery.

7.3.11 Thermal Protection

7.3.12 Device Modulation Scheme

7.3.13 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme

7.3.14 Ferrite Bead Filter Considerations

7.3.15 When to Use an Output Filter for EMI Suppression

7.3.16 AM Avoidance EMI Reduction

7.4 Device Functional Modes

7.4.1 Mono Mode (PBTL)

Explains how to configure the device for mono operation using PBTL.

8 Application and Implementation

8.2 Typical Application

Details a specific 2.1 channel Master/Slave application example.

8.2.2 Detailed Design Procedure

8.2.2.1 Select the PWM Frequency

Guidance on selecting the PWM frequency using AM pins.

8.2.2.2 Select the Amplifier Gain and Master;Slave Mode

How to select gain and master/slave mode based on power and impedance.

9 Power Supply Recommendations

10 Layout

10.1 Layout Guidelines

Offers guidelines for PCB layout to meet EMC requirements.

10.2 Layout Example

10.3 Heat Sink Used on the EVM

11 Device and Documentation Support

11.1 Related Links

Provides quick access links to technical documents, support, and software.

11.5 Electrostatic Discharge Caution

Warning about handling integrated circuits to prevent ESD damage.

12 Mechanical, Packaging, and Orderable Information

PACKAGING INFORMATION

Orderable Device

Lists the orderable device part numbers.

Package Type

Specifies the package type (e.g., HTSSOP).

MSL Peak Temp

Moisture Sensitivity Level and peak solder temperature.

TAPE AND REEL INFORMATION

REEL DIMENSIONS

Diagram and description of reel dimensions.

TAPE DIMENSIONS

Diagram and description of tape dimensions.

MECHANICAL DATA

DAP (R-PDSO-G32) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE

Detailed mechanical dimensions and drawing for the DAP package.

THERMAL PAD MECHANICAL DATA

LAND PATTERN DATA

PACKAGE OUTLINE

EXAMPLE BOARD LAYOUT

EXAMPLE STENCIL DESIGN

GENERIC PACKAGE VIEW

PACKAGE OUTLINE

EXAMPLE BOARD LAYOUT

EXAMPLE STENCIL DESIGN

IMPORTANT NOTICE AND DISCLAIMER