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PACKAGE OUTLINE
C
0.25
GAGE PLANE
0.75
0.50
A
11.1
10.9
NOTE 3
B
6.2
6.0
8.3
7.9
TYP
30X 0.65
32X
0.30
0.19
2X
9.75
(0.15) TYP
0 - 8
0.15
0.05
1.15
1.00
4.36
3.26
4.11
3.31
PowerPAD TSSOP - 1.15 mm max heightDAD0032A
PLASTIC SMALL OUTLINE
4222646/B 02/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
PowerPAD is a trademark of Texas Instruments.
TM
1
32
0.1 C A B
17
16
PIN 1 ID AREA
EXPOSED
THERMAL PAD
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.600
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