Texas Instruments TPA31 D2 Series - EXAMPLE BOARD LAYOUT

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EXAMPLE BOARD LAYOUT
(7.5)
0.05 MAX
AROUND
0.05 MIN
AROUND
32X (1.5)
32X (0.45)
30X (0.65)
(R0.05) TYP
PowerPAD TSSOP - 1.15 mm max heightDAD0032A
PLASTIC SMALL OUTLINE
4222646/B 02/2020
SYMM
SYMM
SEE DETAILS
LAND PATTERN EXAMPLE
SCALE:8X
1
16
17
32
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
TM
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED