Texas Instruments TPA31 D2 Series - EXAMPLE STENCIL DESIGN

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EXAMPLE STENCIL DESIGN
32X (1.5)
32X (0.45)
(7.5)
30X (0.65)
(R0.05) TYP
PowerPAD TSSOP - 1.15 mm max heightDAD0032A
PLASTIC SMALL OUTLINE
4222646/B 02/2020
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
TM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:8X
SYMM
SYMM
1
16
17
32