Texas Instruments TPA31 D2 Series - EXAMPLE STENCIL DESIGN

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EXAMPLE STENCIL DESIGN
32X (1.5)
32X (0.45)
(3.04)
(3.74)
BASED ON
0.125 THICK
STENCIL
(7.5)
30X (0.65)
PowerPAD TSSOP - 1.2 mm max heightDAP0032C
PLASTIC SMALL OUTLINE
4223691/A 05/2017
2.57 X 3.160.175
2.78 X 3.410.15
3.04 X 3.74 (SHOWN)0.125
3.40 X 4.180.1
SOLDER STENCIL
OPENING
STENCIL
THICKNESS
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
TM
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
SYMM
SYMM
1
16
17
32
BASED ON
0.125 THICK
STENCIL
BY SOLDER MASK
METAL COVERED
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES