Texas Instruments TPA31 D2 Series User Manual

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EXAMPLE STENCIL DESIGN
32X (1.5)
32X (0.45)
(3.04)
(3.74)
BASED ON
0.125 THICK
STENCIL
(7.5)
30X (0.65)
PowerPAD TSSOP - 1.2 mm max heightDAP0032C
PLASTIC SMALL OUTLINE
4223691/A 05/2017
2.57 X 3.160.175
2.78 X 3.410.15
3.04 X 3.74 (SHOWN)0.125
3.40 X 4.180.1
SOLDER STENCIL
OPENING
STENCIL
THICKNESS
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
TM
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
SYMM
SYMM
1
16
17
32
BASED ON
0.125 THICK
STENCIL
BY SOLDER MASK
METAL COVERED
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES

Texas Instruments TPA31 D2 Series Specifications

General

Brand	Texas Instruments
Model	TPA31 D2 Series
Category	Amplifier
Language	English