u-blox NEO-8Q Series - Contents; Table of Contents

NEO-8Q / NEO-M8 - Hardware Integration Manual
UBX-15029985 - R04 Production Information Contents
Page 4 of 31
Contents
Preface ........................................................................................................................................... 3
Contents ........................................................................................................................................ 4
1 Hardware description ............................................................................................................. 6
1.1 Overview .............................................................................................................................................................. 6
1.2 Configuration ....................................................................................................................................................... 6
1.3 Connecting power ................................................................................................................................................ 6
1.3.1 VCC: Main supply voltage ............................................................................................................................. 6
1.3.2 V_BCKP: Backup supply voltage .................................................................................................................... 6
1.3.3 VDD_USB: USB interface power supply ......................................................................................................... 7
1.3.4 VCC_RF: Output voltage RF .......................................................................................................................... 7
1.4 Interfaces.............................................................................................................................................................. 7
1.4.1 UART ............................................................................................................................................................ 7
1.4.2 USB .............................................................................................................................................................. 7
1.4.3 Display Data Channel (DDC) .......................................................................................................................... 8
1.4.4 SPI ................................................................................................................................................................ 8
1.4.5 TX_READY .................................................................................................................................................... 8
1.5 I/O pins ................................................................................................................................................................. 9
1.5.1 RESET_N: Reset ............................................................................................................................................. 9
1.5.2 EXTINT: External interrupt ............................................................................................................................. 9
1.5.3 SAFEBOOT_N ................................................................................................................................................ 9
1.5.4 D_SEL: Interface select .................................................................................................................................. 9
1.5.5 TIMEPULSE (TIMEPULSE1 on NEO-M8T) ......................................................................................................... 9
1.5.6 TIMEPULSE2 ............................................................................................................................................... 10
1.5.7 LNA_EN: LNA enable .................................................................................................................................. 10
1.6 Electromagnetic interference on I/O lines ............................................................................................................ 10
2 Design .................................................................................................................................... 11
2.1 Pin description .................................................................................................................................................... 11
2.1.1 Pin name changes ....................................................................................................................................... 12
2.2 Minimal design ................................................................................................................................................... 13
2.3 Layout: Footprint and paste mask ....................................................................................................................... 13
2.4 Antenna ............................................................................................................................................................. 14
2.4.1 Antenna design with passive antenna ......................................................................................................... 14
2.4.2 Active antenna design................................................................................................................................. 15
3 Migration to u-blox 8 / M8 modules .................................................................................... 17
3.1 Migrating u-blox 7 designs to NEO-8Q and NEO-M8 series modules .................................................................... 17
3.2 Hardware migration NEO-6 -> NEO-8Q and NEO-M8 series ................................................................................. 17
3.3 Software migration ............................................................................................................................................. 18
4 Product handling................................................................................................................... 19
4.1 Packaging, shipping, storage and moisture preconditioning ................................................................................ 19
4.2 Soldering ............................................................................................................................................................ 19
4.3 EOS/ESD/EMI precautions .................................................................................................................................... 22
4.4 Applications with cellular modules ...................................................................................................................... 26