MIA-M10Q-Integration manual
Figure 34: Recommended copper land and solder mask opening for MIA-M10Q
Recommended stencil thickness is 100 µm.
These are only recommendations and not specifications. The exact geometry, distances,
stencil thicknesses and solder paste volumes must be adapted to the customer's specific
production processes (for example, soldering).
UBX-21028173 - R01
3 Hardware integration Page 75 of 89
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