Ublox MIA-M10Q User Manual

MIA-M10Q-Integration manual
4.2 Packaging
The MIA-M10Q modules are delivered as hermetically sealed, reeled tapes in order to enable efficient
production, production lot set-up and tear-down. For more information, see the u-blox packaging
information reference [4].
4.2.1 Reels
MIA-M10Q modules are deliverable in quantities of 1000 pieces on a reel. They are shipped on reel
type D, as specified in the u-blox Packaging information reference [4].
4.2.2 Moisture sensitivity level
The moisture sensitivity level (MSL) for MIA-M10Q modules is specified in the table below.
Package MSL level
SiP (professional grade) 3
Table 31: MSL level
For MSL standard see IPC/JEDEC J-STD-020, and J-STD-033 that can be downloaded from
www.jedec.org. For more information regarding moisture sensitivity levels, labeling, storage and
drying, see the u-blox packaging information reference [4].
4.3 Soldering
Reflow soldering procedures are described in the IPC/JEDEC J-STD-020 standard.
When populating the modules, make sure that the pick and place machine is aligned to the
copper pins of the module and not to the module edge.
Soldering paste
Use of “no clean” soldering paste is highly recommended, as it does not require cleaning after
the soldering process. The paste-mask geometry for applying soldering paste should meet the
recommendations given in the Layout section.
Reflow soldering
Parameters Symbol Values
Preheat/ Soak temperature min.
Preheat/ Soak temperature max.
Preheat/ Soak time from T
smin
to T
smax
T
smin
T
smax
T
s
(T
smin
to T
smax
)
150 °C
180 °C
90 to 110 seconds
Liquidus temperature
Time maintained above T
L
T
L
t
L
217 °C
40 to 60 seconds
Peak package body temperature T
P
250 °C
Average ramp-up rate (T
smax
to T
P
) 0.8 °C/ second max.
Time within +5 °C... -5 °C of T
P
20 to 40 seconds
Ramp-down rate (T
P
to T
L
) 6 °C/ second max.
Time 25 °C to T
P
) 8 minutes max.
Table 32: Recommended conditions for reflow process
The peak temperature must not exceed 255 °C. The time above 245 °C must not exceed 40 seconds.
Modules must not be soldered with a damp heat process.
UBX-21028173 - R01
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Ublox MIA-M10Q Specifications

General

Brand	Ublox
Model	MIA-M10Q
Category	Control Unit
Language	English