MIA-M10Q-Integration manual
Optical inspection
After soldering the module, consider optical inspection to check that the module is properly aligned
and centered over the pads.
Repeated reflow soldering
Only single reflow soldering process is recommended.
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices require wave soldering to solder the THT components. Only a single wave
soldering process is encouraged for boards populated with modules.
Rework
Not recommended.
Use of ultrasonic processes
Some components on the module are sensitive to ultrasonic waves. Use of any ultrasonic processes
(cleaning, welding etc.) may cause damage to the GNSS receiver.
u-blox offers no warranty against damages to the module caused by ultrasonic processes.
UBX-21028173 - R01
4 Product handling Page 78 of 89
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